74hct1g32gv NXP Semiconductors, 74hct1g32gv Datasheet

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74hct1g32gv

Manufacturer Part Number
74hct1g32gv
Description
2-input Or Gate
Manufacturer
NXP Semiconductors
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74HCT1G32GV
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
1. General description
2. Features
3. Ordering information
Table 1.
4. Marking
Table 2.
Type number
74HC1G32GW
74HCT1G32GW
74HC1G32GV
74HCT1G32GV
Type number
74HC1G32GW
74HCT1G32GW
74HC1G32GV
74HCT1G32GV
Ordering information
Marking codes
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
74HC1G32 and 74HCT1G32 are high-speed Si-gate CMOS devices. They provide a
2-input OR function.
The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.
The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
The standard output currents are half those of the 74HC32 and 74HCT32.
I
I
I
I
I
74HC1G32; 74HCT1G32
2-input OR gate
Rev. 04 — 14 May 2007
Symmetrical output impedance
High noise immunity
Low power dissipation
Balanced propagation delays
SOT353-1 and SOT753 package options
TSSOP5
SC-74A
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
plastic surface-mounted package; 5 leads
Marking code
HG
TG
H32
T32
Product data sheet
Version
SOT353-1
SOT753

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74hct1g32gv Summary of contents

Page 1

... C to +125 C 74HCT1G32GW 74HC1G32GV +125 C 74HCT1G32GV 4. Marking Table 2. Marking codes Type number 74HC1G32GW 74HCT1G32GW 74HC1G32GV 74HCT1G32GV Description TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SC-74A plastic surface-mounted package; 5 leads Marking code HG TG H32 T32 Product data sheet ...

Page 2

... NXP Semiconductors 5. Functional diagram Fig 1. Logic symbol Fig 3. Logic diagram 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin GND 74HC_HCT1G32_4 Product data sheet Y 4 mna164 Fig 2. IEC logic symbol ...

Page 3

... NXP Semiconductors 7. Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Inputs Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage ...

Page 4

... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at T Symbol Parameter For type 74HC1G32 V HIGH-level input IH voltage V LOW-level input IL voltage V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I supply current ...

Page 5

... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at T Symbol Parameter I supply current CC I additional supply CC current C input capacitance I 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 6.0 ns. All typical values are measured at T ...

Page 6

... NXP Semiconductors 12. Waveforms Fig 5. The input (A and B) to output (Y) propagation delays Measurement points are given Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 6. Load circuitry for switching times 74HC_HCT1G32_4 Product data sheet 74HC1G32 ...

Page 7

... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE ...

Page 8

... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) 74HC_HCT1G32_4 Product data sheet scale ...

Page 9

... Quick Reference Data and Soldering sections removed. • Section 2 “Features” • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. 74HC_HCT1G32_3 20020515 ...

Page 10

... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

Page 11

... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 Abbreviations ...

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