hi5735 Intersil Corporation, hi5735 Datasheet

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hi5735

Manufacturer Part Number
hi5735
Description
12-bit, 80 Msps, High Speed Video D/a Converter
Manufacturer
Intersil Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
hi5735KCB
Manufacturer:
INTERSIL
Quantity:
20 000
Part Number:
hi5735KCBZ
Manufacturer:
MAXIM
Quantity:
1 001
12-Bit, 80 MSPS, High Speed Video D/A
Converter
The HI5735 is a 12-bit, 80 MSPS, D/A converter which is
implemented in the Intersil BiCMOS 10V (HBC-10) process.
Operating from +5V and -5.2V, the converter provides
-20.48mA of full scale output current and includes an input
data register and bandgap voltage reference. Low glitch
energy and excellent frequency domain performance are
achieved using a segmented architecture. The digital inputs
are TTL/CMOS compatible and translated internally to ECL.
All internal logic is implemented in ECL to achieve high
switching speed with low noise. The addition of laser
trimming assures 12-bit linearity is maintained along the
entire transfer curve.
Ordering Information
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
HI5735KCB
HI5735KCBZ (Note)
PART NUMBER
RANGE (°C)
TEMP.
0 to 70
0 to 70
®
1
28 Lead SOIC
28 Lead SOIC
(Pb-free)
Data Sheet
PACKAGE
M28.3
M28.3
DWG. #
PKG.
1-888-INTERSIL or 321-724-7143
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Copyright Harris Corporation 1998. Copyright Intersil Americas Inc. 2003, 2004. All Rights Reserved
Features
• Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . . 80 MSPS
• Low Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .650mW
• Integral Linearity Error . . . . . . . . . . . . . . . . . . . . 0.75 LSB
• Low Glitch Energy . . . . . . . . . . . . . . . . . . . . . . . . . 3.0pV-s
• TTL/CMOS Compatible Inputs
• Improved Hold Time . . . . . . . . . . . . . . . . . . . . . . . . 0.25ns
• Excellent Spurious Free Dynamic Range
• Pb-free Available
Applications
• Professional Video
• Cable TV Headend Equipment
Pinout
D11 (MSB)
All other trademarks mentioned are the property of their respective owners.
D0 (LSB)
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
D10
NC
NC
July 2004
D9
D8
D7
D6
D5
D4
D3
D2
D1
10
11
12
13
14
1
2
3
4
5
6
7
8
9
HI5735 (SOIC)
TOP VIEW
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DGND
AGND
REF OUT
CTRL OUT
CTRL IN
R
AV
I
I
ARTN
DV
DGND
DV
CLOCK
OUT
OUT
SET
HI5735
EE
EE
CC
FN4133.5

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hi5735 Summary of contents

Page 1

... Data Sheet 12-Bit, 80 MSPS, High Speed Video D/A Converter The HI5735 is a 12-bit, 80 MSPS, D/A converter which is implemented in the Intersil BiCMOS 10V (HBC-10) process. Operating from +5V and -5.2V, the converter provides -20.48mA of full scale output current and includes an input data register and bandgap voltage reference. Low glitch energy and excellent frequency domain performance are achieved using a segmented architecture ...

Page 2

... D4 DATA 12-BIT D5 BUFFER/ MASTER LEVEL REGISTER D6 SHIFTER D10 (MSB) D11 CLK AV AGND DV DGND HI5735 +5V HI5735 V (16) CC D11 D11 (MSB) (1) D10 (2) D10 (24) CTRL IN D9 (3) D9 (25) CTRL OUT D8 ( (5) (26) REF OUT (7) (21) I OUT D4 D4 (8) D3 ...

Page 3

... Operating Conditions Temperature Range HI5735KCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. ...

Page 4

... Parameter guaranteed by design or characterization and not production tested All devices are 100% tested 100% production tested at temperature extremes for military temperature devices, sample tested for industrial temperature devices. 5. Dynamic Range must be limited swing within the compliance range. 4 HI5735 = -4.94 to -5.46V +4.75 to +5.25V TEST CONDITIONS (Note 4) ...

Page 5

... OUT SETT FIGURE 1. FULL SCALE SETTLING TIME DIAGRAM CLK t SU D11-D0 I OUT t PD FIGURE 3. PROPAGATION DELAY, SETUP TIME, HOLD TIME AND MINIMUM PULSE WIDTH DIAGRAM 5 HI5735 50% ± LSB ERROR BAND 2 FIGURE 2. PEAK GLITCH AREA (SINGLET) MEASUREMENT t t PW1 PW2 ...

Page 6

... FIGURE 4. TYPICAL POWER DISSIPATION OVER TEMPERATURE 1.5 0.5 -0.5 1.5 0 600 1200 1800 2400 CODE FIGURE 6. TYPICAL INL -40 - TEMPERATURE FIGURE 8. OFFSET CURRENT OVER TEMPERATURE 6 HI5735 -1.21 -1.23 -1.25 -1.27 -1. -50 FIGURE 5. TYPICAL REFERENCE VOLTAGE OVER 0.8 0.4 0.0 -0.4 -0.8 3000 3600 4200 ATTEN 20dB RL -10.0dBm 100 CENTER 1 ...

Page 7

... SET Clocks and Termination The internal 12-bit register is updated on the rising edge of the clock. Since the HI5735 clock rate can run to 80 MSPS, to minimize reflections and clock noise into the part, proper termination should be used. In PCB layout clock runs should be kept short and have a minimum of loads. To guarantee ...

Page 8

... C of temperature drift Settling Time The settling time of the HI5735 is measured as the time it takes for the output of the DAC to settle to within a ±1/2 LSB error band of its final value during a full scale (code 0000... . This improves EE to 1111 ...

Page 9

... GLITCH ENERGY = ( t (ns) FIGURE 13. MEASURING GLITCH ENERGY To convert the output of the HI5735 to a bipolar 4V swing, the following applications circuit is recommended. The reference can only provide 125µA of drive must be buffered to create the bipolar offset current needed to generate the -2V output with all bits “off”. The output current must be converted to a voltage and then gained up and offset to produce the proper swing ...

Page 10

... HI5735 PASSIVATION: Type: Sandwich Passivation Undoped Silicon Glass (USG) + Nitride Thickness: USG - 8k Total 12.2k DIE ATTACH: Silver Filled Epoxy SUBSTRATE POTENTIAL (POWERED UP): V EED HI5735 D9 D10 D11 DGND CLK DV DGND CC Å Å , Nitride - 4.2k ± +2k Å Å CTRL OUT CTRL IN ...

Page 11

... No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com For information regarding Intersil Corporation and its products, see www.intersil.com 11 HI5735 HI5735 M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE M ...

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