adsp-2188m Analog Devices, Inc., adsp-2188m Datasheet - Page 40

• Manufacturer Part Number: adsp-2188m
• Description: Dsp Microcomputer
• Manufacturer: Analog Devices, Inc.

ADSP-2188M
Part Number
ADSP-2188MKST-300
ADSP-2188MBST-266
ADSP-2188MKCA-300
ADSP-2188MBCA-266
thick) are now designated as LQFP.
In 1998, JEDEC reevaluated the specifications for the TQFP package designation, assigning it to packages 1.0 mm thick. Previously labeled TQFP packages (1.6 mm
COPLANARITY
100-Lead Metric Thin Plastic Quad Flatpack (LQFP)
NOTE:
THE ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08 FROM ITS IDEAL
POSITION WHEN MEASURED IN THE LATERAL DIRECTION.
MAX LEAD
0.75
0.60 TYP
0.50
SEATING
0 – 7
PLANE
0.08
1.60 MAX
0.15
0.05
6 ± 4
12
TYP
(ST-100)
25
100
1
26
Ambient Temperature
Range
0°C to 70°C
–40°C to +85°C
0°C to 70°C
–40°C to +85°C
LEAD PITCH
BSC
0.50
16.20
16.00 TYP SQ
15.80
14.05
14.00 TYP SQ
13.95
(PINS DOWN)
12.00 BSC
TOP VIEW
LEAD WIDTH
0.27
0.22 TYP
0.17
Dimensions shown in millimeters.
OUTLINE DIMENSIONS
76
50
ORDERING GUIDE
75
51
Instruction
Rate
75
66
75
66
10.10
10.00 SQ
9.90
1.
2.
MAX
1.40
NOTES:
THE ACTUAL POSITION OF THE BALL
POPULATION IS WITHIN 0.150 OF ITS
IDEAL POSITION RELATIVE TO THE
PACKAGE EDGES.
THE ACTUAL POSITION OF EACH BALL
IS WITHIN 0.08 OF ITS IDEAL POSITION
RELATIVE TO THE BALL POPULATION.
TOP VIEW
10.10
10.00 SQ
9.90
DETAIL A
144-Ball Mini-BGA
Package
Description
100-Lead LQFP
100-Lead LQFP
144-Ball Mini-BGA
144-Ball Mini-BGA
(CA-144)
BSC
8.80
BSC
0.40
0.25
0.80
12 11 10 9 8 7 6 5 4 3 2 1
BALL DIAMETER
0.55
0.50
0.45
DETAIL A
0.80 BSC
8.80 BSC
MAX
0.12
Package
Option
ST-100
ST-100
CA-144
CA-144
SEATING
PLANE
1.00
0.85
A
B
C
D
E
F
G
H
J
K
L
M