mpc8308 Freescale Semiconductor, Inc, mpc8308 Datasheet - Page 79
mpc8308
Manufacturer Part Number
mpc8308
Description
Mpc8308 Powerquicc Ii Pro Processor Hardware Specification
Manufacturer
Freescale Semiconductor, Inc
Datasheet
1.MPC8308.pdf
(88 pages)
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22 Thermal
This section describes the thermal specifications of the device.
22.1
Table 59
Freescale Semiconductor
Junction to Ambient Natural Convection
Junction to Ambient Natural Convection
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top
1
2
Notes:
0–1
For any core_clk:csb_clk ratios, the core_clk must not exceed its maximum operating frequency of 333 MHz.
Core VCO frequency = core frequency × VCO divider. Note that VCO divider has to be set properly so that the
core VCO frequency is in the range of 400–800 MHz.
10
00
01
10
RCWL[COREPLL]
provides the package thermal characteristics for the 473, 19 × 19 mm MAPBGA.
Thermal Characteristics
Characteristic
0010
0011
0011
0011
2–5
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 1
6
1
0
0
0
Table 59. Package Thermal Characteristics for MAPBGA
Table 58. e300 Core PLL Configuration (continued)
core_clk: csb_clk Ratio
2.5:1
3:1
3:1
3:1
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
Natural Convection
Board Type
—
—
1
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJA
θJA
θJB
θJC
JT
VCO Divider (VCOD)
Value
8
2
4
8
42
27
35
24
17
9
2
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Thermal
Notes
1,2,3
1,2
1,3
1,3
4
5
6
79