mpc5604p Freescale Semiconductor, Inc, mpc5604p Datasheet - Page 29

• Manufacturer Part Number: mpc5604p
• Description: Mpc5604p Microcontroller Data Sheet
• Manufacturer: Freescale Semiconductor, Inc

Freescale Semiconductor
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No. Symbol
No.
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Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Flow rate of forced air flow.
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
R
Symbol
R
R
R
R
R
θJCtop
R
Ψ
R
R
θJCtop
Ψ
θJMA
θJMA
θJMA
θJB
θJB
θJA
θJA
JT
JT
Thermal resistance junction-to-ambient
Thermal resistance junction to board
Thermal resistance junction to case (top)
Junction to package top natural convection
Thermal resistance junction-to-ambient
natural convection
Thermal resistance junction-to-ambient
natural convection
Thermal resistance junction-to-ambient
Thermal resistance junction-to-ambient
Thermal resistance junction to board
Thermal resistance junction to case (Top)
Junction to package top natural convection
Table 8. Thermal Characteristics for 144-pin LQFP
Table 9. Thermal Characteristics for 100-pin LQFP
Preliminary—Subject to Change Without Notice
Parameter
MPC5604P Microcontroller Data Sheet, Rev. 3
Parameter
2
2
4
3
2
2
2
5
4
6
5
@ 200 ft./min.
2s2p
Single layer board - 1s
Four layer board - 2s2p
@ 200 ft./min., single layer board -
1s
@ 200 ft./min., four layer board -
2s2p
Conditions
Conditions
3
, four layer board -
1
(continued)
1
Typical
Typical
Value
Value
37
31
12
52
39
42
33
24
12
2
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
29