ad8138-ep Analog Devices, Inc., ad8138-ep Datasheet - Page 7

• Manufacturer Part Number: ad8138-ep
• Description: Low Distortion Differential Adc Driver Ad8138-ep
• Manufacturer: Analog Devices, Inc.

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
V
Output Voltage Swing
Internal Power Dissipation
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
specified for the device soldered in a circuit board in still air.
Table 6.
Package Type
8-Lead MSOP/4-Layer
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8138-EP package
is limited by the associated rise in junction temperature (T
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the AD8138-EP. Exceeding a junction temperature
of 150°C for an extended period can result in changes in the
silicon devices, potentially causing failure.
JA
OCM
is specified for the worst-case conditions, that is, θ
Rating
±5.5 V
±V
See Figure 4 and Figure 5
550 mW
−55°C to +105°C
−65°C to +150°C
300°C
150°C
S
θ
145
JA
JA
Unit
°C/W
is
J
) on
Rev. 0 | Page 7 of 12
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
quiescent current (I
and common-mode currents flowing to the load, as well as
currents flowing through the external feedback networks and
internal common-mode feedback loop. The internal resistor tap
used in the common-mode feedback loop places a negligible
differential load on the output. RMS voltages and currents should
be considered when dealing with ac signals.
Airflow reduces θ
with the package leads from metal traces, through holes, ground,
and power planes reduces the θ
Figure 3 shows the maximum safe power dissipation vs. the
ambient temperature for the 8-lead MSOP (θ
package on a JEDEC standard 4-layer board. θ
approximations.
ESD CAUTION
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
JA
S
. In addition, more metal directly in contact
). The load current consists of the differential
AMBIENT TEMPERATURE (°C)
JA
.
D
) is the sum of the
JA
AD8138-EP
JA
= 145°C/W)
S
values are
) times the