hsdl-3201 LiteOn Technology Corp., hsdl-3201 Datasheet - Page 12
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hsdl-3201
Manufacturer Part Number
hsdl-3201
Description
Irda Data 1.4 Low Power Compliant 115.2 Kb/s Infrared Transceiver
Manufacturer
LiteOn Technology Corp.
Datasheet
1.HSDL-3201.pdf
(20 pages)
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Appendix A: HSDL-3201#021
SMT Assembly Application Note
Solder Pad, Mask, and Metal Stencil
Recommended Metal Solder
Stencil Aperture
It is recommended that only a 0.127
mm (0.005 inches) or a 0.11 mm (0.004
inches) thick stencil be used for solder
paste printing. This is to ensure
adequate printed solder paste volume
and no shorting. See the table below
the drawing for combinations of metal
stencil aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad is 2.7
mm x 1.25 mm as per land pattern.
12
APERTURE
STENCIL
SOLDER
MASK
Stencil Thickness, t (mm)
0.127 mm
0.11 mm
LAND
PATTERN
l
APERTURES AS PER
LAND DIMENSIONS
METAL STENCIL
FOR SOLDER PASTE
PRINTING
PCB
length, l
1.75
2.4
0.05
0.05
Aperture Size (mm)
w
width, w
0.55
0.55
0.05
0.05
t