pga370 ETC-unknow, pga370 Datasheet - Page 81

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pga370

Manufacturer Part Number
pga370
Description
Mpu Pentium Iii 64-bit 0.18um 700mhz 370-pin Fcpga
Manufacturer
ETC-unknow
Datasheet
Datasheet
Figure 33. Dimensions of Mechanical Step Feature in Heatsink Base
The fan heatsink is designed to allow visibility of the FC-PGA processor markings located on top
of the package. The FC-PGA processor markings are visible after installation of the fan heatsink
due to notched sides of the heatsink base (see
asymmetrical in that the mechanical step feature (see
The step allows the heatsink to securely interface with the processor in order to meet thermal
requirements.
Note: The heatsink airflow keepout zones found in
processor’s active fan heatsink. This does not reflect the worst-case dimensions that may exist with
other third party passive or active fan heatsinks.
The Pentium III processor is manufactured in two different packages: FC-PGA and FC-PGA2. For
specifications on these two packages please see
of Pentium III processors are offered in both packages. The thermal solutions for these two
packages are incompatible. Therefore, the thermal solution shipped with each boxed Pentium III
processor should only be used with the accompanied processor.
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
Figure
0.472
Section 5.0
Figure 35
34). The boxed processor fan heatsink is also
Figure
of this document. Not all frequencies
33) must sit over the socket’s cam.
refer specifically to the boxed
0.043
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