w83627thg Winbond Electronics Corp America, w83627thg Datasheet - Page 105

• Manufacturer Part Number: w83627thg
• Description: Winbond Lpc I/o
• Manufacturer: Winbond Electronics Corp America

CRF0 (Default 0x00)
CRF1 (Default 0x00)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
Bit 6 - 5 : Devices' trap status.
Bit 4
Bit 3 - 0 : Devices' trap status.
: CHIPPME. Chip level auto power management enable.
= 0 disable the auto power management functions
= 1 enable the auto power management functions.
Reserved
: MIDIPME. MIDI port auto power management enable.
= 0 disable the auto power management functions
= 1 enable the auto power management functions.
: Reserved. Return zero when read.
: PRTPME. Printer port auto power management enable.
= 0 disable the auto power management functions.
= 1 enable the auto power management functions.
: FDCPME. FDC auto power management enable.
= 0 disable the auto power management functions.
= 1 enable the auto power management functions.
: URAPME. UART A auto power management enable.
= 0 disable the auto power management functions.
= 1 enable the auto power management functions.
: URBPME. UART B auto power management enable.
= 0 disable the auto power management functions.
= 1 enable the auto power management functions.
: WAK_STS. This bit is set when the chip is in the sleeping state and an enabled resume
event occurs. Upon setting this bit, the sleeping/working state machine will transition the
system to the working state. This bit is only set by hardware and is cleared by writing a 1
to this bit position or by the sleeping/working state machine automatically when the global
standby timer expires.
= 0 the chip is in the sleeping state.
= 1 the chip is in the working state.
: Reserved. Return zero when read.
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W83627THF/W83627THG