w83627hg Winbond Electronics Corp America, w83627hg Datasheet - Page 109

• Manufacturer Part Number: w83627hg
• Description: Winbond Lpc I/o
• Manufacturer: Winbond Electronics Corp America

CRF0 °Default 0x00±
CRF1 °Default 0x00±
6 - 5
3 - 0
BIT
BIT
7
6
5
4
3
2
1
0
7
4
CHIPPME. Chip level auto power management enable.
0š Disable the auto power management functions
1š Enable the auto power management functions.
CIRPME. Consumer IR port auto power management enable.
0š Disable the auto power management functions
1š Enable the auto power management functions.
MIDIPME. MIDI port auto power management enable.
0š Disable the auto power management functions
1š Enable the auto power management functions.
Reserved. Return zero when read.
PRTPME. Printer port auto power management enable.
0š Disable the auto power management functions.
1š Enable the auto power management functions.
FDCPME. FDC auto power management enable.
0š Disable the auto power management functions.
1š Enable the auto power management functions.
URAPME. UART A auto power management enable.
0š Disable the auto power management functions.
1š Enable the auto power management functions.
URBPME. UART B auto power management enable.
0š Disable the auto power management functions.
1š Enable the auto power management functions.
WAK_STS. This bit is set when the chip is in the sleeping state and an enabled resume
event occurs. Upon setting this bit, the sleeping/working state machine will transition
the system to the working state. This bit is only set by hardware and is cleared by writ-
ing a 1 to this bit position or by the sleeping/working state machine automatically when
the global
standby timer expires.
0š the chip is in the sleeping state.
1š the chip is in the working state.
Devices' trap status.
Reserved. Return zero when read.
Devices' trap status.
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DESCRIPTION
DESCRIPTION
W83627HF/ F/ HG/ G
Publication Release Date: June 09, 2006
Revision 2.27