hc55171b Intersil Corporation, hc55171b Datasheet - Page 2

• Manufacturer Part Number: hc55171b
• Description: Low Cost 5 Ren Ringing Slic For Isdn Modem/ta And Wl
• Manufacturer: Intersil Corporation

Electrical Specifications
RINGING TRANSMISSION PARAMETERS
V
4-Wire to 2-Wire Gain
AC TRANSMISSION PARAMETERS
RX Input Impedance
OUT1 Positive Output Voltage Swing
OUT1 Negative Output Voltage Swing
4-Wire Input Overload Level
2-Wire Return Loss
2-Wire Longitudinal to Metallic Balance
Off Hook
4-Wire Longitudinal Balance Off Hook
Longitudinal Current Capability
Insertion Loss, 2-Wire to 4-Wire
Insertion Loss, 4-Wire to 2-Wire
Insertion Loss, 4-Wire to 4-Wire
Frequency Response
RING
Absolute Maximum Ratings
Maximum Supply Voltages
Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +15V
Operating Conditions
Temperature Range
Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V to +12V
Positive Power Supply (V
Negative Power Supply (V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied
NOTES:
1.
2. All grounds (AGND, BGND) must be applied before V
(V
(V
HC55171BIM, HC55171BIB . . . . . . . . . . . . . . . . . . -40
wishes to run separate grounds off a line card, the AGND must be applied first.
CC
CC
Input Impedance
JA
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V
)-(V
is measured with the component mounted on an evaluation board PC board in free air.
BAT
PARAMETER
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90V
CC
BAT
) . . . . . . . . . . . . . . . . . . . . . . . +5V 5%
64
). . . . . . . . . . . . . . . . . . . -16V to -80V
Unless Otherwise Specified, Typical Parameters are at T
Operating Temperature Range, V
at 600 2-Wire terminating impedance.
T
A
= 25
300Hz to 3400Hz Referenced to Absolute Level
(Note 3)
V
300Hz to 3.4kHz (Note 3)
R
R
300Hz to 3.4kHz R
(Note 3)
Matched for 600 , f = 300Hz (Note 3)
Matched for 600 , f = 1000Hz (Note 3)
Matched for 600 , f = 3400Hz (Note 3)
Per ANSI/IEEE STD 455-1976 300Hz to 3400Hz
(Note 3)
300Hz to 3400Hz (Note 3)
I
0dBmO, 1kHz, Includes Transhybrid Amp Gain = 3
0dBmO,1kHz
0dBmO, 1kHz, Includes Transhybrid Amp Gain = 3
at 1kHz, 0dBm Referenced 600
LINE
o
RING
L
L
C
= 10k (Note 3)
= 10k (Note 3)
= 40mA, T
to V
T-R
o
CC
C to 85
TEST CONDITIONS
(Note 3)
HC55171B
or V
A
= 25
L
o
BAT
BAT
= 1200 , 600 Reference
C
o
C (Note 3)
. Failure to do so may result in premature failure of the part. If a user
= -24V, V
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Junction Temperature, Plastic Packages . . . . . . . . 150
Maximum Storage Temperature Range . . . . . . . . . .-65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
Die Characteristics
Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Diode Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Die Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 x 144
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI
ESD (Human Body Model) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V
PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(SOIC, PLCC - Lead Tips Only)
CC
= +5V, AGND = BGND = 0V. All AC Parameters are specified
A
= 25
o
C, Min-Max Parameters are over
+2.5
MIN
-4.5
37
40
30
40
40
-
-
-
-
-
-
-
-
-
+3.1
TYP
108
5.4
0.05
0.05
0.02
40
40
-
-
-
-
-
-
-
-
MAX
0.35
0.06
0.2
0.2
-
-
-
-
-
-
-
-
-
-
-
-
o
mA
UNITS
V
C to 150
JA
V/V
PEAK
k
k
dB
dB
dB
dB
dB
dB
dB
dB
dB
V
V
RMS
(
55
70
o
C/W)
BAT
o
o
o
C
C
C