isd5008 Winbond Electronics Corp America, isd5008 Datasheet - Page 43

• Manufacturer Part Number: isd5008
• Description: Single-chip, Voice Record / Playback Device 4-, 5-, 6- And 8-second Duration
• Manufacturer: Winbond Electronics Corp America

1.
2.
3.
ISD
The backside of die is internally connected to V
may occur.
Double bond recommended.
This figure reflects the current die thickness. Please contact ISD as this thickness may change in the future.
ISD5008 Series
I.
II.
III.
Die Dimensions
X: 166.5 ±1 mils
Y: 302.4 ±1 mils
Die Thickness
11.5 ±1.0 mils
Pad Opening (min)
90 x 90 microns
3.5 x 3.5 mils
Figure 24: ISD5008 Series Bonding Physical Layout
(3)
V
SSA
MIC+
MIC–
V
SSD
ANAOUT+
V
SSD
SS
MISO
. It MUST NOT be connected to any other potential or damage
ANAOUT– ACAP
MOSI
SS SCLK V
SP–
ISD5008
CCD
V
(1)
SSA
(Unpackaged Die)
(2)
V
CCD
SP+
XCLK
V
CCA
INT
(2)
ANA IN
RAC
ISD5008 Product
V
AUX IN
SSA
AUXOUT
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