ada4830-1 Analog Devices, Inc., ada4830-1 Datasheet - Page 5

• Manufacturer Part Number: ada4830-1
• Description: High Speed Difference Amplifier With Input Short To Battery Protection
• Manufacturer: Analog Devices, Inc.

Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage (+VS pin)
Input Voltage Positive Direction (INN, INP)
Input Voltage Negative Direction (INN, INP)
Reference Voltage (VREF pin)
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
conductivity, 4-layer (2s2p) circuit board, as described in
EIA/JESD 51-7.
Table 4.
Package Type
8-Lead LFCSP
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the
package is limited by the associated rise in junction temperature
(T
transition temperature, the plastic changes its properties.
Exceeding a junction temperature of 150°C for an extended
time can result in changes in the silicon devices, potentially
causing failure.
JA
J
) on the die. At approximately 150°C, which is the glass
is specified for the device soldered to a high thermal
ADA4830-1
θ
116
JA
Rating
6 V
22 V
−10 V
+V
See Figure 2
−65°C to +125°C
−40°C to +125°C
260°C
150°C
S
+ 0.3 V
Unit
°C/W
Rev. 0 | Page 5 of 16
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
quiescent current (I
depends on the particular application. The power due to load
drive is calculated by multiplying the load current by the
associated voltage drop across the device. RMS voltages and
currents must be used in these calculations.
Airflow increases heat dissipation, effectively reducing θ
Figure 2 shows the maximum power dissipation in the package
vs. the ambient temperature for the 8-lead LFCSP (116°C/W) on
a JEDEC standard 4-layer board. θ
ESD CAUTION
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10
Ambient Temperature for a 4-Layer Board
Figure 2. Maximum Power Dissipation vs.
20
S
). The power dissipated due to load drive
AMBIENT TEMPERATURE (°C)
30
40
50
JA
values are approximate.
60
D
) is the sum of the
70
80
ADA4830-1
S
) times the
90
100
JA
.