ada4950-1 Analog Devices, Inc., ada4950-1 Datasheet - Page 7

• Manufacturer Part Number: ada4950-1
• Description: Low Power, Selectable Gain Differential Adc Driver, G = 1, 2, 3
• Manufacturer: Analog Devices, Inc.

ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
Supply Voltage
Power Dissipation
Input Current, +INx, −INx, PD
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
to a high thermal conductivity 2s2p printed circuit board, as
described in EIA/JESD51-7.
Table 8. Thermal Resistance
Package Type
ADA4950-1, 16-Lead LFCSP (Exposed Pad)
ADA4950-2, 24-Lead LFCSP (Exposed Pad)
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4950-x package
is limited by the associated rise in junction temperature (T
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the ADA4950-x. Exceeding a junction temper-
ature of 150°C for an extended period can result in changes in
the silicon devices, potentially causing failure.
JA
ADA4950-1
ADA4950-2
is specified for the device (including exposed pad) soldered
Rating
11 V
See Figure 4
±5 mA
−65°C to +125°C
−40°C to +105°C
−40°C to +105°C
300°C
150°C
θ
91
65
JA
θ
28
16
JC
J
Unit
°C/W
°C/W
) on
Rev. 0 | Page 7 of 28
The power dissipated in the package (P
cent power dissipation and the power dissipated in the package
due to the load drive. The quiescent power is the voltage between
the supply pins (V
dissipated due to the load drive depends upon the particular
application. The power dissipated due to the load drive is calcu-
lated by multiplying the load current by the associated voltage
drop across the device. RMS voltages and currents must be used
in these calculations.
Airflow increases heat dissipation, effectively reducing θ
addition, more metal directly in contact with the package leads/
exposed pad from metal traces, through holes, ground, and
power planes reduces θ
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the single 16-lead
LFCSP (91°C/W) and the dual 24-lead LFCSP (65°C/W) on
a JEDEC standard 4-layer board with the exposed pad soldered
to a PCB pad that is connected to a solid plane.
ESD CAUTION
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
–40
–20
S
) times the quiescent current (I
ADA4950-1
AMBIENT TEMPERATURE (°C)
0
JA
for a 4-Layer Board
.
ADA4950-1/ADA4950-2
20
40
ADA4950-2
D
) is the sum of the quies-
60
80
S
). The power
100
JA
. In