NB7V52MMNTXG ON Semiconductor, NB7V52MMNTXG Datasheet - Page 10

• Manufacturer Part Number: NB7V52MMNTXG
• Description: IC FLIP FLOP DIFF RST/CML 16-QFN
• Manufacturer: ON Semiconductor
• Type: D-Typer

Specifications of NB7V52MMNTXG

• Function: Reset
• Output Type: Differential
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Delay Time - Propagation: 300ps
• Trigger Type: Negative Edge
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Current - Output High, Low: -
• Frequency - Clock: -

PUBLICATION ORDERING INFORMATION
The products described herein (NB7V52M), may be covered by U.S. patents including
GigaComm is a trademark of Semiconductor Components Industries, LLC (SCILLC).
LITERATURE FULFILLMENT:
16 X
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
NOTE 3
A B
DETAIL A
16X
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
b
4
1
DETAIL B
16
BOTTOM VIEW
SIDE VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
TOP VIEW
5
D2
D
13
8
(A3)
e
12
9
EXPOSED PAD
A1
e
A
B
E
E2
A
EXPOSED Cu
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
C
SEATING
PLANE
L1
http://onsemi.com
CASE 485G−01
É É É É É É
16 PIN QFN
ISSUE D
ALTERNATE TERMINAL
CONSTRUCTIONS
CONSTRUCTIONS
10
DETAIL B
MOLD CMPD
ALTERNATE
DETAIL A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L
0.575
0.022
0.128
6,362,644.
3.25
A1
É É Ç Ç Ç Ç
There may be other patents pending.
SOLDERING FOOTPRINT*
L
A3
0.012
0.30
NOTES:
0.128
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
3.25
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
DIM
A1
A3
D2
max
E2
L1
A
D
E
K
b
e
L
CONDITION CAN NOT VIOLATE 0.2 MM
MILLIMETERS
MIN
0.80
0.00
0.18
1.65
1.65
0.30
0.00
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.18 TYP
0.50
0.02
MAX
1.00
0.05
0.30
1.85
1.85
0.50
0.15
SCALE 10:1
EXPOSED PAD
0.059
1.50
0.012
0.30
NB7V52M/D
inches
mm