7wbd383 ON Semiconductor, 7wbd383 Datasheet

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7wbd383

Manufacturer Part Number
7wbd383
Description
7wbd383 Translating Bus Exchange Switch
Manufacturer
ON Semiconductor
Datasheet

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7wbd383USG
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5 000
7WBD383
Translating Bus Exchange
Switch
bus exchange switch in ultra−small footprints.
Features
This document contains information on some products that are still under development.
ON Semiconductor reserves the right to change or discontinue these products without
notice.
© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 0
The 7WBD383 is an advanced high−speed low−power translating
High Speed: t
3 W Switch Connection Between 2 Ports
Power Down Protection Provided on Inputs
Zero Bounce
TTL−Compatible Control Inputs
Ultra−Small Pb−Free Packages
These are Pb−Free Devices
PD
= 0.25 ns (Max) @ V
CC
= 4.5 V
1
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
*Date Code orientation may vary depending
(Note: Microdot may be in either location)
1
1
upon manufacturing location.
1
1
1
8
ORDERING INFORMATION
8
A
Y
W
M
G
http://onsemi.com
CASE 613AA
CASE 613AB
CASE 613AC
CASE 523AN
CASE 517AJ
CASE 846A
MU SUFFIX
MU SUFFIX
DM SUFFIX
US SUFFIX
CASE 493
1.45 x 1.0
1.95 x 1.0
Micro8]
ULLGA8
ULLGA8
ULLGA8
= Assembly Location
= Year
= Work Week
= Date Code
= Pb−Free Package
1.6 x 1.0
UDFN8
UQFN8
US8
Publication Order Number:
DIAGRAMS
MARKING
1
8
1
7WBD383/D
8
1
AG M*G
AJ M*G
AQM
AQM
AYWG
ALM
D383
6M
G
G
G
G
G
G
G

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7wbd383 Summary of contents

Page 1

... Translating Bus Exchange Switch The 7WBD383 is an advanced high−speed low−power translating bus exchange switch in ultra−small footprints. Features • High Speed 0.25 ns (Max • Switch Connection Between 2 Ports • Power Down Protection Provided on Inputs • Zero Bounce • ...

Page 2

GND Figure 1. ULLGA8/UDFN8 (Top Thru−View FUNCTION TABLE Input ...

Page 3

MAXIMUM RATINGS Symbol V DC Supply Voltage CC V Control Pin Input Voltage IN V Switch Input / Output Voltage I/O I Control Pin DC Input Diode Current IK I Switch I/O Port DC Diode Current OK I ON−State Switch ...

Page 4

DC ELECTRICAL CHARACTERISTICS Symbol Parameter V Clamp Diode Voltage IK V High−Level Input Voltage IH (Control) V Low−Level Input Voltage IL (Control) V Output Voltage High OH I Input Leakage Current IN I Power Off Leakage Current OFF I Quiescent ...

Page 5

TYPICAL DC CHARACTERISTICS 3.75 3.50 3.25 3.00 2.75 2.50 2.25 2.00 4.50 4.75 5.00 5. SUPPLY VOLTAGE (V) CC 3.75 3.50 3.25 3.00 2.75 2.50 2.25 2.00 4.50 4.75 5.00 5. SUPPLY VOLTAGE (V) CC 3.75 ...

Page 6

From Output 500 W Under Test pF* L 500 W *C includes probes and jig capacitance. L 1.5 V Input t PLH 1.5 V Output Voltage Waveforms Propagation Delay Times 6. Waveform 1 is for an output ...

Page 7

... ORDERING INFORMATION Device 7WBD383USG 7WBD383MUTAG 7WBD383AMUTCG 7WBD383AMX1TCG 7WBD383BMX1TCG 7WBD383CMX1TCG 7WBD383DMR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package US8 (Pb−Free) UDFN8 (Pb−Free) UQFN8 (Pb−Free) ULLGA8 – 0.5 mm Pitch (Pb− ...

Page 8

... NOTE 0.32 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 ASME Y14.5M, 1994. TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0 ...

Page 9

... *For additional information on our Pb−Free strategy and soldering NOTE 3 0.05 C details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0 ...

Page 10

... *For additional information on our Pb−Free strategy and soldering 0.05 C NOTE 3 details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND ...

Page 11

... *For additional information on our Pb−Free strategy and soldering 0.05 C NOTE 3 details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 ASME Y14.5M, 1994. AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED ...

Page 12

... OPTIONAL CONSTRUCTION 0. 0.25 7X NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 12 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0 ...

Page 13

... PLANE 0.10 (0.004 SOLDERING FOOTPRINT* 3.8 0.15 1.8 0.50 0.07 0.0197 1.0 0.0394 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS US8 CASE 493−02 ISSUE B J DETAIL 0.10 (0.004 0.10 TYP ...

Page 14

... BSC 0.026 BSC 0.40 0.55 0.70 0.016 0.021 0.028 4.75 4.90 5.05 0.187 0.193 0.199 5.28 0.208 mm inches ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative 7WBD383/D MAX ...

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