7wbd383 ON Semiconductor, 7wbd383 Datasheet - Page 13

• Manufacturer Part Number: 7wbd383
• Description: 7wbd383 Translating Bus Exchange Switch
• Manufacturer: ON Semiconductor

*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.0197
SEATING
PLANE
−T−
0.50
P
B
D
0.10 (0.004)
8
SOLDERING FOOTPRINT*
1
A
G
5
K
M
0.0394
4
1.0
−X−
T
L
0.15
0.07
3.8
1.8
−Y−
X Y
C
0.10 (0.004)
SCALE 8:1
V
R
PACKAGE DIMENSIONS
inches
J
T
0.012
mm
0.30
DETAIL E
U
http://onsemi.com
S
CASE 493−02
ISSUE B
US8
DETAIL E
13
N
H
F
R 0.10 TYP
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
4. DIMENSION “B” DOES NOT INCLUDE
5. LEAD FINISH IS SOLDER PLATING WITH
6. ALL TOLERANCE UNLESS OTHERWISE
ANSI Y14.5M, 1982.
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
SPECIFIED ±0.0508 (0.0002 “).
DIM
G
M
A
B
C
D
F
H
K
L
N
P
R
S
U
V
J
MILLIMETERS
MIN
1.90
2.20
0.60
0.17
0.20
0.10
0.00
3.00
0.23
0.23
0.37
0.60
0.50 BSC
0.40 REF
0.12 BSC
0
5
_
_
MAX
2.10
2.40
0.90
0.25
0.35
0.18
0.10
3.20
0.34
0.33
0.47
0.80
10
6
_
_
0.075
0.087
0.024
0.007
0.008
0.004
0.000
0.118
0.010
0.009
0.015
0.024
MIN
0.020 BSC
0.016 REF
0.005 BSC
0
5
INCHES
_
_
0.083
0.094
0.035
0.010
0.014
0.007
0.004
0.126
0.013
0.013
0.019
0.031
MAX
10
6
_
_