25lc256 Microchip Technology Inc., 25lc256 Datasheet - Page 14

• Manufacturer Part Number: 25lc256
• Description: 256k Spi Bus Serial Eeprom
• Manufacturer: Microchip Technology Inc.

25AA256/25LC256
4.0
4.1
DS21822F-page 14
PACKAGING INFORMATION
Package Marking Information
8-Lead SOIC (3.90 mm)
8-Lead DFN
8-Lead PDIP
XXXXXXXT
XXXXYYWW
8-Lead TSSOP
XXXXXXXX
T/XXXNNN
XXXXXXX
T/XXXXX
Legend: XX...X
Note:
Note:
YYWW
NNN
YYWW
NNN
XXXX
TYWW
NNN
For very small packages with no room for the Pb-free JEDEC designator
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
e
3
T
Y
YY
WW
NNN
e
3
, the marking will only appear on the outer carton or reel label.
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Example
25LC256I
SN
Example:
Example:
25LC256
I/P
25LC256
Example:
I/MF
e
0528
e
3
1L7
0528
5LE
I528
3
1L7
1L7
0528
:
1L7
e
3
8-Lead SOIC (208 mil)
XXXXXXXX
YYWWNNN
XXXXXXXX
25AA256
25LC256
Device
TSSOP 1st Line Marking Codes
Standard
5AE
5LE
© 2007 Microchip Technology Inc.
Rotated
5AEX
5LEX
I/SM
25LC256
05281L7
Example:
e
3