25lc256 Microchip Technology Inc., 25lc256 Datasheet - Page 18

• Manufacturer Part Number: 25lc256
• Description: 256k Spi Bus Serial Eeprom
• Manufacturer: Microchip Technology Inc.

25AA256/25LC256
(JEITA/EIAJ Standard, Formerly called SOIC)
DS21822F-page 18
8-Lead Plastic Small Outline (SM) – Medium, 5.28 mm Body [SOIJ]
Notes:
1. SOIJ, JEITA/EIAJ Standard, formerly called SOIC.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
A
b
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1
2
D
α
e
E1
Dimension Limits
A2
E
Units
c
A2
A1
E1
N
D
e
A
E
L
b
α
β
φ
c
1.77
1.75
0.05
7.62
5.11
5.13
0.51
0.15
0.36
MIN
0°
–
–
MILLIMETERS
β
1.27 BSC
NOM
8
–
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-056B
© 2007 Microchip Technology Inc.
MAX
2.03
1.98
0.25
8.26
5.38
5.33
0.76
0.25
0.51
15°
15°
8°
L
φ