w25q16bv Winbond Electronics Corp America, w25q16bv Datasheet - Page 58

• Manufacturer Part Number: w25q16bv
• Description: 16m-bit Serial Flash Memory With Dual And Quad Spi
• Manufacturer: Winbond Electronics Corp America

12.
12.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
PACKAGE SPECIFICATION
SYMBOL
E1
D
CP
A1
A2
e
A
C
E
b
L

(2)
(3)
(3)
1.47
0.10
0.33
0.19
4.80
5.80
3.80
0.40
MIN
---
---
0
o
MILLIMETERS
1.27 BSC
TYP.
1.60
1.45
0.41
0.20
4.85
6.00
3.90
0.71
---
---
---
MAX
1.72
0.24
0.50
0.25
4.95
6.19
4.00
1.27
0.10
---
8
o
- 58 -
0.0075
0.058
0.004
0.013
0.189
0.228
0.150
0.015
MIN
---
---
0
o
0.050 BSC
INCHES
0.063
0.057
0.016
0.008
0.191
0.236
0.154
0.028
TYP.
---
---
---
0.0098
0.009
0.004
0.068
0.020
0.195
0.244
0.157
0.050
MAX
---
8
o
W25Q16BV