w9425g6jh Winbond Electronics Corp America, w9425g6jh Datasheet - Page 2

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w9425g6jh

Manufacturer Part Number
w9425g6jh
Description
4 M
Manufacturer
Winbond Electronics Corp America
Datasheet

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8.
9.
10.
11.
OPERATION MODE ....................................................................................................................................17
8.1
8.2
8.3
8.4
ELECTRICAL CHARACTERISTICS ............................................................................................................23
9.1
9.2
9.3
9.4
9.5
9.6
9.7
SYSTEM CHARACTERISTICS FOR DDR SDRAM.....................................................................................29
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
TIMING WAVEFORMS ................................................................................................................................34
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10 Auto-precharge Timing (Write Cycle) ...............................................................................................42
7.10.3 CAS Latency field (A6 to A4)................................................................................................16
7.10.4 DLL Reset bit (A8) ................................................................................................................16
7.10.5 Mode Register /Extended Mode register change bits (BA0, BA1) ........................................16
7.10.6 Extended Mode Register field ..............................................................................................16
7.10.7 Reserved field ......................................................................................................................16
Simplified Truth Table ......................................................................................................................17
Function Truth Table ........................................................................................................................18
Function Truth Table for CKE...........................................................................................................21
Simplified Stated Diagram ................................................................................................................22
Absolute Maximum Ratings..............................................................................................................23
Recommended DC Operating Conditions ........................................................................................23
Capacitance .....................................................................................................................................24
Leakage and Output Buffer Characteristics......................................................................................24
DC Characteristics ...........................................................................................................................25
AC Characteristics and Operating Condition ....................................................................................26
AC Test Conditions ..........................................................................................................................27
Table 1: Input Slew Rate for DQ, DQS, and DM ..............................................................................29
Table 2: Input Setup & Hold Time Derating for Slew Rate ...............................................................29
Table 3: Input/Output Setup & Hold Time Derating for Slew Rate....................................................29
Table 4: Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate ....................................29
Table 5: Output Slew Rate Characteristics (X16 Devices only)........................................................29
Table 6: Output Slew Rate Matching Ratio Characteristics ..............................................................30
Table 7: AC Overshoot/Undershoot Specification for Address and Control Pins..............................30
Table 8: Overshoot/Undershoot Specification for Data, Strobe, and Mask Pins...............................31
System Notes: ..................................................................................................................................32
Command Input Timing ....................................................................................................................34
Timing of the CLK Signals ................................................................................................................34
Read Timing (Burst Length = 4) .......................................................................................................35
Write Timing (Burst Length = 4) .......................................................................................................36
DM, DATA MASK (W9425G6JH) .....................................................................................................37
Mode Register Set (MRS) Timing.....................................................................................................38
Extend Mode Register Set (EMRS) Timing ......................................................................................39
Auto-precharge Timing (Read Cycle, CL = 2) ..................................................................................40
Auto-precharge Timing (Read cycle, CL = 2), continued..................................................................41
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Publication Release Date: May 26, 2010
W9425G6JH
Revision A01

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