s-24c04bphal Seiko Instruments Inc., s-24c04bphal Datasheet - Page 27
s-24c04bphal
Manufacturer Part Number
s-24c04bphal
Description
2-wire Cmos Serial E2prom
Manufacturer
Seiko Instruments Inc.
Datasheet
1.S-24C04BPHAL.pdf
(35 pages)
- Current page: 27 of 35
- Download datasheet (285Kb)
Rev.3.0
Precautions
Precautions for WLP package
• Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in
• SII claims no responsibility for any and all disputes arising out of or in connection with any infringement
• The side of device silicon substrate is exposed to the marking side of device package. Since this portion
• In this package, the overcoat of the resin of translucence is carried out on the side of device area. Keep
electrostatic protection circuit.
of the products including this IC upon patents owned by a third party.
has lower strength against the mechanical stress than the standard plastic package, chip, crack, etc
should be careful of the handing of a package enough. Moreover, the exposed side of silicon has
electrical potential of device substrate, and needs to be kept out of contact with the external potential.
it mind that it may affect the characteristic of a device when exposed a device in the bottom of a high
light source.
_00
Seiko Instruments Inc.
2-WIRE CMOS SERIAL E
S-24C04BPHAL
2
PROM
27
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