74ABT273CMTCX Fairchild Semiconductor, 74ABT273CMTCX Datasheet
74ABT273CMTCX
Specifications of 74ABT273CMTCX
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74ABT273CMTCX Summary of contents
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... Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Connection Diagram © 1999 Fairchild Semiconductor Corporation Features Eight edge-triggered D-type flip-flops Buffered common clock ...
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Truth Table Operating Mode Reset (Clear) Load “1” Load “0” H HIGH Voltage Level steady state h HIGH Voltage Level one setup time prior to the LOW-to-HIGH clock transition L LOW Voltage Level steady state I LOW Voltage Level one ...
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Absolute Maximum Ratings Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias V Pin Potential to Ground Pin CC Input Voltage (Note 2) Input Current (Note 5.0 mA Voltage Applied to Any Output in the ...
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AC Electrical Characteristics (SSOIC package) Symbol Parameter f Maximum Clock Frequency MAX t Propagation Delay PLH PHL n t Propagation Delay PHL Operating Requirements Symbol Parameter t (H) Setup Time, HIGH ...
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AC Loading *Includes jig and probe capacitance FIGURE 1. Standard AC Test Load Amplitude 3.0V FIGURE 3. Test Input Signal Requirements AC Waveforms FIGURE 4. Propagation Delay, Pulse Width Waveforms FIGURE 5. 3-STATE Output HIGH and LOW Enable and Disable ...
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Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body www.fairchildsemi.com Package Number M20B 6 ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D 7 www.fairchildsemi.com ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide www.fairchildsemi.com Package Number MSA20 8 ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves ...