bd82000fvj ROHM Co. Ltd., bd82000fvj Datasheet - Page 4

• Manufacturer Part Number: bd82000fvj
• Description: High Side Switch Ic
• Manufacturer: ROHM Co. Ltd.

●Cautions on use
(1) Absolute Maximum Ratings
(2) Power supply and GND line
(3) GND voltage
(4) Short circuit between terminals and erroneous mounting
(5) Operation in strong electromagnetic field
(6) Input terminals
(7) External capacitor
(8) Thermal shutdown circuit (TSD)
(9) Thermal design
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention
to the interference by common impedance of layout pattern when there are plural power supplies and GND lines.
Especially, when there are GND pattern for small signal and GND pattern for large current included the external
circuits, separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the
power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the
characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low
temperature, thus determining the constant.
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous
mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between
terminals or between the terminal and the power supply or the GND terminal, the ICs can break down.
Be noted that using ICs in the strong electromagnetic field can malfunction them.
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of
the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then
breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to
apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate.
Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In
addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power
supply voltage or within the guaranteed value of electrical characteristics.
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
When junction temperatures become 170°C (typ) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.
REV. A
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