bd8165muv ROHM Co. Ltd., bd8165muv Datasheet - Page 4

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bd8165muv

Manufacturer Part Number
bd8165muv
Description
Multi-channel Power Ic
Manufacturer
ROHM Co. Ltd.
Datasheet

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Operation Notes
1. Absolute maximum range
2. Ground potential
3. Setting of heat
4 . Short Circuit between Terminal and Soldering
5 . Electromagnetic Field
6. Ground wiring patterns
7. This IC is a monolithic IC which has P+ isolation in the P substrate and between the various pins.
8. Over current protection circuit
9. Built-in thermal circuit
10.Testing on application boards
11.Discontiguous mode
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits as well as operation faults and physical damage. Accordingly, you must not use methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin.
When testing the IC on an application board, connecting a capacitor to a pin with low impedance
subjects the IC to stress. Always discharge capacitors after each process or step. Ground the IC
during assembly steps as an antistatic measure, and use similar caution when transporting or storing the
IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture
during the inspection process.
The DC/DC converters of this IC are designed for being used in contiguous current mode, normally. The special consideration on adjusting
the inductance or the resistive output load to avoid the discontiguous current mode should be properly done.
For example, when a resistor and a transistor is connected to a pin.
The over-current protection circuits are built in at output, according to their respective current outputs and prevent the IC
from being damaged when the load is short-circuited or over-current. But, these protection circuits are effective for preventing
destruction by unexpected accident. When it’s in continuous protection circuit moving period don’t use please. And for ability,
because this chip has minus characteristic, be careful for heat plan.
A temperature control circuit is built in the IC to prevent the damage due to overheat.
Therefore, all the outputs are turned off when the thermal circuit works and are turned on when the temperature goes down to
the specified level.
Use a setting of heat that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions..
Mal-function may happen when the device is used in the strong electromagnetic field.
A P-N junction is formed from this P layer and the N layer of each pin.
SIMPLIFIED STRUCTURE OF
the IC on circuit board, please be unusually cautious about the orientation and the
single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused
by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring patterns
of any external components.
Don’t short-circuit between Output pin and the power supply pin, Output pin and GND pin, or the power supply pin and GND pin.When soldering
position of the IC. When the orientation is mistaken the IC may be destroyed.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a
This product are produced with strict quality control, but might be destroyed in using beyond absolute maximum ratings. Open IC
destroyed a failure mode cannot be defined (like Short mode, or Open mode).
Therefore physical security countermeasure, like fuse, is to be given when a specified mode to be beyond absolute maximum ratings
is considered.
GND terminal should be a lowest voltage potential every state.
Please make sure all pins which is over ground even if include transient feature.
BI-POLAR IC
(PinA)
GND
resister
parasitic diode
(PinB)
parasitic diode or transistor
REV. D
Psubstrate
GND
GND
near-by other element
(PinA)
(PinB)
Parasitic diode
parasitic diode or transistor
GND
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