vn770kp-e STMicroelectronics, vn770kp-e Datasheet

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vn770kp-e

Manufacturer Part Number
vn770kp-e
Description
Quad Smart Power Solid State Relay For Complete H-bridge Configurations
Manufacturer
STMicroelectronics
Datasheet

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VN770KP-E
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VN770KP-E
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Part Number:
VN770KP-E
Manufacturer:
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Features
1. Total resistance of one side in bridge configuration
2. Typical current limitation value
Description
The VN770KP-E is a device formed by three
monolithic chips housed in a standard SO-28
package: a double high side and two low side
switches. Both the double high side and low side
switches are made using STMicroelectronics
VIPower™ M0-3 Technology.
Table 1.
July 2011
VN770KP-E
ECOPACK
Automotive Grade: compliance with AEC
guidelines
Suited as low voltage bridge
Linear current limitation
Very low standby power dissipation
Short circuit protected
Status flag diagnostic (open drain)
Integrated clamping circuits
Undervoltage protection
ESD protection
Type
Device summary
Package
®
SO-28
225 mΩ
: lead free and RoHS compliant
R
DS(on)
(1)
9 A
I
OUT
(2)
36 V
V
Doc ID 022021 Rev 1
CC
VN770KP-E
for complete H-bridge configurations
Tube
Quad smart power solid state relay
This device is suitable to drive a DC motor in a
bridge configuration as well as to be used as a
quad switch for any low voltage application.
The dual high side switches have built-in thermal
shutdown to protect the chips from over
temperature and current limiter blocks to protect
the device from short circuit. Status output is
provided to indicate open load in off and on-state
and over temperature.
The low side switches are two OMNIFET II types
(fully auto protected Power MOSFET in
VIPower™ technology). They have built-in
thermal shutdown, linear current limitation and
overvoltage clamping. Fault feedback for thermal
intervention can be detected by monitoring the
voltage at the input pin.
Order codes
SO-28
VN770KPTR -E
VN770KP-E
Tape and reel
www.st.com
1/33
1

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vn770kp-e Summary of contents

Page 1

... Undervoltage protection ■ ESD protection Description The VN770KP device formed by three monolithic chips housed in a standard SO-28 package: a double high side and two low side switches. Both the double high side and low side switches are made using STMicroelectronics VIPower™ M0-3 Technology. ...

Page 2

... Thermal calculation in clockwise and anti-clockwise operation in steady state mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.2.1 4.2.2 4.2.3 4.2.4 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.1 ECOPACK 5.2 SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.3 SO-28 tube shipment 5.4 Tape and reel shipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2/33 Thermal resistances definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Thermal calculation in transient mode . . . . . . . . . . . . . . . . . . . . . . . . . 26 Single pulse thermal impedance definition . . . . . . . . . . . . . . . . . . . . . . 26 Pulse calculation formula . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 ® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Doc ID 022021 Rev 1 VN770KP-E ...

Page 3

... VN770KP-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Pin definition and function Table 3. Thermal data Table 4. Dual high side switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 5. Low side switch Table 6. Power outputs (per each channel Table 7. Switching (per each channel) (V Table 8. Logic input (per each channel Table 9. ...

Page 4

... CC =5V =3.5V =5V =10Ohm =7A =3.5V =5V Doc ID 022021 Rev 1 VN770KP-E ...

Page 5

... VN770KP-E Figure 49. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . 25 Figure 50. SO-28 HSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . 27 Figure 51. SO-28 LSD thermal impedance junction ambient single pulse Figure 52. Thermal fitting model of an H-bridge in SO- Figure 53. SO-28 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 54. ...

Page 6

... Block diagram and pin description 1 Block diagram and pin description Figure 1. Block diagram 6/33 Doc ID 022021 Rev 1 VN770KP-E ...

Page 7

... VN770KP-E Table 2. Pin definition and function 25 10, 19 12, 14, 15 16, 17 20, 21 22, 23 26, 27 Figure 2. Connection diagram Name DRAIN 3 Drain of switch 3 (low-side switch) INPUT 3 Input of switch 3 (low-side switch) N.C. Not connected Drain of switches 1 and 2 (high-side switches) and power ...

Page 8

... Table 5. Low side switch Symbol V Drain source voltage ( Input voltage IN I Input current IN 8/33 Parameter heat sink) Parameter = 25°C) C Parameter = Doc ID 022021 Rev 1 VN770KP-E Value Max (°C/ See Figure 49 Value Unit 41 V -0.3 V -200 mA Internally limited ±10 mA ±10 mA ...

Page 9

... VN770KP-E Table 5. Low side switch (continued) Symbol R Minimum input series impedance IN MIN I Drain current D I Reverse DC output current R V Electrostatic discharge (R = 1.5 KΩ 100 pF) ESD1 Electrostatic discharge on output pin only (human V ESD2 body model 330 Ω 150 pF) P Power dissipation (T tot ...

Page 10

... V to (1) OUT — Min Typ 1 3.25 0.5 6 6.8 -0.7 Min Typ = 5 V STAT = 5 V STAT 6 6.8 -0.7 Min Typ 150 175 135 - 7 15 VN770KP-E Max Unit — µs — µs — V/µs — V/µs Max Unit 1.25 V µ µ Max Unit 0 µA 100 ...

Page 11

... VN770KP-E Table 10. Protections (per each channel) (continued) Symbol Parameter I Current limitation lim Turn-off output clamp V demag voltage Note: To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles ...

Page 12

... V; gen — 5.4 — 3 gen — 6 — 18 Min Typ = 0 V — 0.8 IN — 220 — 0.28 — 2.5 VN770KP-E Max Unit 65 mΩ 130 mΩ Max Unit — S — pF Max Unit 300 ns 1500 ns 1500 ns 1000 ns 2.3 µs 14 µs 16 µs 11 µs A/µ ...

Page 13

... VN770KP-E -40°C < T < 150°C, unless otherwise specified. j Table 17. Protections Symbol Parameter I Drain current limit lim t Step response current limit V dlim Over temperature T jsh shutdown T Over temperature reset jrs I Fault sink current gf Single pulse avalanche E as energy 2.5 Dual high-side switch timing data Figure 3 ...

Page 14

... Truth table (continued) Conditions Undervoltage Overvoltage Output voltage > V Output current < Figure 4. Open-load status timing (with external pull-up) Figure 5. Over temperature status timing 14/33 Input Doc ID 022021 Rev 1 VN770KP-E Output Status ...

Page 15

... VN770KP-E 2.6 Electrical characterization for dual high side switch Figure 6. Off-state output current IL(off1) (µA) 1.6 1.44 Off state 1.28 Vcc=36V Vin=Vout=0V 1.12 0.96 0.8 0.64 0.48 0.32 0.16 0 -50 - (ºC) Figure 8. High level input current Figure 10. Input low level voltage Vil (V) 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 -50 - (ºC) Figure 7. ...

Page 16

... Figure 17. On-state resistance vs V case Ron (mOhm) 400 350 300 250 200 150 100 50 0 100 125 150 175 5 Doc ID 022021 Rev 1 VN770KP LIM case Vcc=13V - 100 125 150 Tc (ºC) Vcc=13V Rl=13Ohm - 100 ...

Page 17

... VN770KP-E Figure 18. Status leakage current Ilstat (µA) 0.03 0.0275 Vstat=5V 0.025 0.0225 0.02 0.0175 0.015 0.0125 0.01 0.0075 0.005 0.0025 0 -50 - (ºC) Figure 20. Openload on-state detection threshold Iol (mA Vcc=13V 50 Vin= -50 - (ºC) Figure 22. Status clamp voltage ...

Page 18

... Electrical specifications 2.7 Electrical characterization for low side switches Figure 23. Static drain source on resistance Figure 25. Transconductance Figure 27. Turn-on current slope (V 18/33 Figure 24. Derating curve Figure 26. Transfer characteristics =5V) Figure 28. Turn-on current slope (V in Doc ID 022021 Rev 1 VN770KP-E =3.5V) in ...

Page 19

... VN770KP-E Figure 29. Input voltage vs input charge Figure 31. Switching time resistive load (V =5V) in Figure 33. Output characteristics Figure 30. Capacitance variations Figure 32. Switching time resistive load (R =10Ohm) g Figure 34. Step response current limit Doc ID 022021 Rev 1 Electrical specifications 19/33 ...

Page 20

... Figure 35. Source drain diode forward characteristics Figure 37. Static drain source on resistance vs input voltage (I d Figure 39. Normalized input threshold voltage vs temperature 20/33 Figure 36. Static drian source on resistance vs v Figure 38. Static drain source on resistance vs =7A) Figure 40. Normalized on resistance vs Doc ID 022021 Rev 1 VN770KP input voltage temperature ...

Page 21

... VN770KP-E Figure 41. Turn-off drain source voltage slope (V =3.5V) in Figure 43. Current limit vs junction temperature Figure 42. Turn-off drain source voltage slope (V =5V) in Doc ID 022021 Rev 1 Electrical specifications 21/33 ...

Page 22

... Even if a reverse polarity diode is not present recommended to use a capacitor or Zener at V because a similar problem appears in case the supply terminal of the module CC has intermittent electrical contact to the battery or gets disconnected while the motor is operating. 22/33 in case the bridge becomes BATT ), a blocking capacitor (C) is needed to CC Doc ID 022021 Rev 1 VN770KP-E ...

Page 23

... VN770KP-E Figure 45. Recommended motor operation Application recommendations Doc ID 022021 Rev 1 23/33 ...

Page 24

... Application recommendations Figure 46. Waveforms 24/33 Doc ID 022021 Rev 1 VN770KP-E ...

Page 25

... VN770KP-E 4 Thermal data 4.1 SO-28 thermal data Figure 47. SO-28 PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad layout to 6cm Figure 48. Chipset configuration LOW SIDE CHIP channel 3 R thB Figure 49 ...

Page 26

... thHSLS dLS4 dHS1 thHSLS thLSLS amb thLS thHSLS dLS3 dHS2 thHSLS thLS amb thLSLS ( dLS4 amb dLS4 amb dLS4 amb VN770KP-E T jLS4 + P x dLS4 + T amb + P x dLS3 + T amb ...

Page 27

... VN770KP-E Figure 50. SO-28 HSD thermal impedance junction ambient single pulse Figure 51. SO-28 LSD thermal impedance junction ambient single pulse Doc ID 022021 Rev 1 Thermal data Footprint Footprint 27/33 ...

Page 28

... R10 (°C/W) R11 = R16 (°C/ (W.s/° C11 (W.s/° (W.s/° C13 (W.s/° C10 (W.s/°C) 1. The blank space means that the value is the same as the previous one. 28/33 (1) ) Footprint 2 2.6 3.5 3.5 15.5 10.5 62.28 150 1.5 0.00025 0.024 0.2 1.6 0.00075 Doc ID 022021 Rev 1 VN770KP 52.28 44.28 32.28 1.61 1.7 3.25 ...

Page 29

... VN770KP-E 5 Package mechanical data ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 SO-28 mechanical data Figure 53. SO-28 package outline ...

Page 30

... DIM 30/33 mm Min. Typ Max. 2.65 0.1 0.3 0.35 0.49 0.23 0.32 0.5 17.7 18.1 10 10.65 1.27 16.51 7.4 7.6 0.4 1.27 Doc ID 022021 Rev 1 inch Min. Typ. 0.004 0.013 0.009 0.020 45° (typ.) 0.697 0.393 0.050 0.650 0.291 0.016 8° (max.) VN770KP-E Max. 0.104 0.012 0.019 0.012 0.713 0.419 0.299 0.050 ...

Page 31

... VN770KP-E 5.3 SO-28 tube shipment Figure 54. Tube dimensions (no suffix) 5.4 Tape and reel shipment Figure 55. Tape and reel dimensions (suffix “13TR”) Doc ID 022021 Rev 1 Package mechanical data 31/33 ...

Page 32

... Revision history 6 Revision history Table 22. Document revision history Date 20-Jul-2011 32/33 Revision 1 Initial release. Doc ID 022021 Rev 1 VN770KP-E Changes ...

Page 33

... VN770KP-E Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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