NBSG53ABA ON Semiconductor, NBSG53ABA Datasheet - Page 17

• Manufacturer Part Number: NBSG53ABA
• Description: IC FLIP FLOP DIFF CLOCK 16FCBGA
• Manufacturer: ON Semiconductor
• Type: D-Type Busr

Specifications of NBSG53ABA

• Function: Reset
• Output Type: Differential
• Number Of Elements: 1
• Number Of Bits Per Element: 2
• Frequency - Clock: 8GHz
• Trigger Type: Positive, Negative
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-FCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Output High, Low: -
• Delay Time - Propagation: -
• Other names: NBSG53ABAOS

LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
-Y-
3 X
E
A
e
0.20
S
A2
-X-
ROTATED 90 CLOCKWISE
A1
VIEW M-M
4
DETAIL K
3
D
_
4
2
PLASTIC 4 X 4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
-Z-
CASE 489-01
BA SUFFIX
FCBGA-16
NBSG53A
M
M
ISSUE O
K
Z
Z
17
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
b
D
E
S
e
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
1.20 REF
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
MAX
0.35
0.50