NBSG53ABA ON Semiconductor, NBSG53ABA Datasheet - Page 17
![IC FLIP FLOP DIFF CLOCK 16FCBGA](/photos/6/52/65284/488-16-fcbga_sml.jpg)
NBSG53ABA
Manufacturer Part Number
NBSG53ABA
Description
IC FLIP FLOP DIFF CLOCK 16FCBGA
Manufacturer
ON Semiconductor
Type
D-Type Busr
Datasheet
1.NBSG53ABA.pdf
(18 pages)
Specifications of NBSG53ABA
Function
Reset
Output Type
Differential
Number Of Elements
1
Number Of Bits Per Element
2
Frequency - Clock
8GHz
Trigger Type
Positive, Negative
Voltage - Supply
2.375 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-FCBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Output High, Low
-
Delay Time - Propagation
-
Other names
NBSG53ABAOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NBSG53ABAHTBG
Manufacturer:
ON Semiconductor
Quantity:
10 000
Company:
Part Number:
NBSG53ABAR2
Manufacturer:
ON Semiconductor
Quantity:
10 000
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
-Y-
3 X
E
A
e
0.20
S
A2
-X-
ROTATED 90 CLOCKWISE
A1
VIEW M-M
4
DETAIL K
3
D
_
4
2
PLASTIC 4 X 4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
-Z-
CASE 489-01
BA SUFFIX
FCBGA-16
NBSG53A
M
M
ISSUE O
K
Z
Z
17
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
b
D
E
S
e
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
1.20 REF
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
MAX
0.35
0.50