hcs11dmsr Intersil Corporation, hcs11dmsr Datasheet
hcs11dmsr
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hcs11dmsr Summary of contents
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... NOTE Logic Level Low Logic level High CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 Pinouts MIL-STD-1835 DESIGNATOR CDIP2-T14, LEAD FINISH C -9 Errors/Gate Day +125 C MIL-STD-1835 DESIGNATOR CDFP3-F14, LEAD FINISH C ...
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... All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Input to Yn TPHL VCC = 4.5V Input to Yn TPLH VCC = 4.5V NOTES: 1. All voltages referenced to device GND measurements assume RL = 500 , CL = ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETERS SYMBOL Data to Output TPHL VCC = 4.5V TPLH VCC = 4.5V NOTES: 1. All voltages referenced to device GND measurements assume RL = 500 , CL = ...
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TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND 10, 11, 13 STATIC BURN-IN II TEST CONNECTIONS (Note DYNAMIC BURN-IN I TEST CONNECTIONS (Note ...
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Die Characteristics DIE DIMENSIONS mils 2.20 x 2.24mm METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k DIE ATTACH: Material: Silver Epoxy WORST CASE CURRENT DENSITY ...