hcs244ms Intersil Corporation, hcs244ms Datasheet - Page 10
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hcs244ms
Manufacturer Part Number
hcs244ms
Description
Radiation Hardened Octal Buffer/line Driver, Three-state
Manufacturer
Intersil Corporation
Datasheet
1.HCS244MS.pdf
(10 pages)
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
108 x 106 mils
Type: Al/Sil
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
5
2
A/cm
A1 1 (4)
Y2 2 (5)
A2 1 (6)
Y1 2 (7)
Å
2
2.6k
Å
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Å
1k
Å
Y3 2
(3)
A3 1
(8)
Y0 2
(9)
A0 1
(2)
HCS244MS
GND
HCS244MS
(10)
321
OE
(1)
A0 2
(11)
VCC
(20)
Y3 1
(12)
OE 2
(19)
A1 2
(13)
Spec Number
(18) Y0 1
(17) A3 2
(16) Y1 1
(15) A2 2
(14) Y2 1
518763