hcs241ms Intersil Corporation, hcs241ms Datasheet

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hcs241ms

Manufacturer Part Number
hcs241ms
Description
Radiation Hardened Inverting Octal Three-state Buffer/line Driver
Manufacturer
Intersil Corporation
Datasheet
September 1995
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
Features
• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm
• Single Event Upset (SEU) Immunity < 2 x 10
• Dose Rate Survivability: >1 x 10
• Dose Rate Upset >10
• Latch Up Free Under Any Conditions
• Military Temperature Range: -55
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• Input Logic Levels
• Input Compatibility Levels Ii
Description
The Intersil HCS241MS is a Radiation Hardened inverting
octal three-state buffer/line driver with two output enables,
one active low, and one active high.
The HCS241MS utilizes advanced CMOS/SOS technology
to achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
The HCS241MS is supplied in a 20 lead ceramic flatpack
(K suffix) or a SBDIP package (D suffix).
Ordering Information
HCS241DMSR
HCS241KMSR
HCS241D/Sample
HCS241K/Sample
HCS241HMSR
Bit-Day (Typ)
- VIL = 30% VCC Max
- VIH = 70% VCC Min
PART NUMBER
10
RAD (Si)/Sec. 20ns Pulse
5 A at VOL, VOH
TEMPERATURE RANGE
12
o
C to +125
RAD (Si)/s
-55
-55
o
o
C to +125
C to +125
+25
+25
+25
o
o
o
C
C
C
o
C
2
/mg
-9
o
o
C
C
Errors/
302
Pinouts
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
GND
BO4
BO3
BO2
BO1
Octal Three-State Buffer/Line Driver
AI1
AI2
AI3
AI4
AE
SCREENING LEVEL
HCS241MS
MIL-STD-1835 CDFP4-F20, LEAD FINISH C
MIL-STD-1835 CDIP2-T20, LEAD FINISH C
FLATPACK PACKAGE (FLATPACK)
20 LEAD CERAMIC DUAL-IN-LINE
Radiation Hardened Inverting
20 LEAD CERAMIC METAL SEAL
METAL SEAL PACKAGE (SBDIP)
GND
BO4
BO3
BO2
BO1
AI1
AI2
AI3
AI4
AE
10
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
10
TOP VIEW
TOP VIEW
20 Lead SBDIP
20 Lead Ceramic Flatpack
20 Lead SBDIP
20 Lead Ceramic Flatpack
Die
20
19
18
17
16
15
14
13
12
11
20
19
18
17
16
15
14
13
12
11
Spec Number
VCC
BE
AO1
BI4
AO2
BI3
AO3
BI2
AO4
BI1
File Number
PACKAGE
518838
VCC
BE
AO1
BI4
AO2
BI3
AO3
BI2
AO4
BI1
3122.1

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hcs241ms Summary of contents

Page 1

... The HCS241MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The HCS241MS is supplied lead ceramic flatpack (K suffi SBDIP package (D suffix). Ordering Information PART NUMBER ...

Page 2

... Functional Diagram AO1 AI1 INPUTS AE AIn High Voltage Level L = Low Voltage Level X = Immaterial Z = High Impedance HCS241MS AO2 AO3 AO4 BO1 BO2 AI2 AI3 AI4 BI1 BI2 ...

Page 3

... VIL = 1.35V (Note 3) NOTES: 1. All voltages referenced to device GND. 2. Force/Measure function may be interchanged. 3. For functional tests, VO 4.0V is recognized as a logic “1”, and VO Specifications HCS241MS Reliability Information Thermal Resistance SBDIP Package 10mA Ceramic Flatpack Package . . . . . . . . . . . ...

Page 4

... The parameters listed in Table 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly tested. These parameters are characterized upon initial design release and upon design changes which would affect these characteristics. Specifications HCS241MS GROUP ...

Page 5

... All voltages referenced to device GND. 2. For functional tests, VO 4.0V is recognized as a logic “1”, and VO TABLE 5. BURN-IN AND OPERATING LIFE TEST, DELTA PARAMETERS (+25 PARAMETER ICC IOL/IOH IOZ Specifications HCS241MS (NOTES 1, 2) CONDITIONS TEMPERATURE 0.5V is recognized as a logic “0”. GROUP B SUBGROUP DELTA LIMIT ...

Page 6

... Each pin except VCC and GND will have a series resistor of 680 OPEN 12, 14, 16, 18 NOTE: Each pin except VCC and GND will have a series resistor of 47K Subgroup 2, sample size is 4 dice/wafer, 0 failures. Specifications HCS241MS TABLE 6. APPLICABLE SUBGROUPS METHOD GROUP A SUBGROUPS 100%/5004 ...

Page 7

... Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 HCS241MS 100% Interim Electrical Test 1 (T1) 100% Delta Calculation (T0-T1) 100% Static Burn-In 2, Condition hrs. min., o +125 C min., Method 1015 ...

Page 8

... Three-State High Timing Diagram and Load Circuit VIH INPUT VS VSS TPZH VOH VT OUTPUT VOZ Three-State Low Timing Diagram and Load Circuit VIH INPUT VS VSS TPZL VOZ VT OUTPUT VOL HCS241MS DUT TPHL PARAMETER VCC VIH VIL VS GND DUT TPHZ VW THREE-STATE HIGH VOLTAGE LEVELS PARAMETER VCC VIH GND ...

Page 9

... Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness:13k 2.6k WORST CASE CURRENT DENSITY < 2 A/cm BOND PAD SIZE: 100 m x 100 m 4 mils x 4 mils Metallization Mask Layout AI2 (4) BO3 (5) AI3 (6) BO2 (7) HCS241MS HCS241MS 310 (18) AO1 (17) BI4 (16) AO2 (15) BI3 (14) AO3 518838 Spec Number ...

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