lpc12d27 NXP Semiconductors, lpc12d27 Datasheet - Page 18
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lpc12d27
Manufacturer Part Number
lpc12d27
Description
32-bit Arm Cortex-m0 Microcontroller; 128 Kb Flash And 8 Kb Sram; 40 Segment X 4 Lcd Driver
Manufacturer
NXP Semiconductors
Datasheet
1.LPC12D27.pdf
(46 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
lpc12d27FBD100/301
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
9. Thermal characteristics
Table 6.
V
LPC12D27
Product data sheet
Symbol
R
R
T
DD
j(max)
th(j-a)
th(j-c)
= 3.0 V to 3.6 V; T
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to case
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
j
•
•
•
=
T
R
P
40
amb
T
D
th(j-a)
amb
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)
P
D
All information provided in this document is subject to legal disclaimers.
Conditions
JEDEC test board; no
air flow
JEDEC test board
C unless otherwise specified.
R
LQFP64 package
LQFP48 package
LQFP64 package
LQFP48 package
th j a
Rev. 1 — 20 September 2011
–
j
(C), can be calculated using the following
Min
-
-
-
DD
32-bit ARM Cortex-M0 microcontroller
and V
DD
Typ
61
86
19
36
-
. The I/O power dissipation of
LPC12D27
Max
-
-
-
-
150
© NXP B.V. 2011. All rights reserved.
Unit
C/W
C/W
C/W
C/W
C
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