mc9s08gw32 Freescale Semiconductor, Inc, mc9s08gw32 Datasheet - Page 35

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mc9s08gw32

Manufacturer Part Number
mc9s08gw32
Description
8-bit Hcs08 Central Processor Unit Cpu
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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3.14
3.15
This section provides details about program/erase times and program-erase endurance for the FLASH memory.
Program and erase operations do not require any special power sources other than the normal V
information about program/erase operations, see the Memory section.
Freescale Semiconductor
1
1
C
D
D
D
D
D
D
D
V
The frequency of this clock is controlled by a software setting.
IREG
C
D
D
D
D
P
P
P
P
D
D
C
C
LCD Frame Frequency
LCD Charge Pump Capacitance
LCD Bypass Capacitance
LCD Glass Capacitance
V
V
V
IREG
IREG
IREG
Max can not exceed V
LCD Specifications
FLASH Specifications
Supply voltage for program/erase
-40°C to 85°C
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Byte program time (random location)
Byte program time (burst mode)
Page erase time
Mass erase time
Byte program current
Page erase current
Program/erase endurance
Data retention
T
T = 25°C
TRIM Resolution
Ripple
L
to T
H
= –40°C to + 85°C
Characteristic
5
2
2
3
Characteristic
DD
PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE
3
-0.15 V
1
4
MC9S08GW64 Series MCU Data Sheet, Rev. 1
Table 21. LCD Electricals, 3-V Glass
Table 22. FLASH Characteristics
2
2
HRefSel = 0
HRefSel = 1
HRefSel = 0
HRefSel = 1
V
Symbol
prog/erase
R
R
V
f
t
t
t
t
t
t
FCLK
IDDBP
IDDPE
D_ret
Burst
Page
Mass
Fcyc
Read
prog
Symbol
C
10,000
Δ
V
f
C
C
Frame
BYLCD
Min
150
RTRIM
1.8
1.8
IREG
15
glass
LCD
5
100,000
Typical
1.49
Min
20,000
.89
1.5
28
4000
100
9
4
4
6
DD
2000
1.00
1.67
Typ
100
100
30
supply. For more detailed
Electrical Characteristics
Max
6.67
200
3.6
3.6
1.85
8000
Max
1.15
100
100
.15
58
.1
1
cycles
years
t
t
t
t
Unit
kHz
mA
mA
Fcyc
Fcyc
Fcyc
Fcyc
μs
V
V
V
Unit
Hz
IREG
nF
nF
pF
%
V
V
35

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