mc9s08mp16 Freescale Semiconductor, Inc, mc9s08mp16 Datasheet - Page 35

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mc9s08mp16

Manufacturer Part Number
mc9s08mp16
Description
8-bit Hcs08 Central Processor Unit Cpu
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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3.1
Example of the device numbering system:
4
The latest package outline drawings are available on the product summary pages on our web site:
http://www.freescale.com/8bit. The following table lists the document numbers per package. Use these numbers in the web
page’s keyword search engine to find the latest package outline drawings.
5
Find the most current versions of all documents at http://www.freescale.com.
6
To provide the most up-to-date information, the revision of our documents on the World Wide Web are the most current. Your
printed copy may be an earlier revision. To verify you have the latest information available, refer to:
Freescale Semiconductor
Pin Count
48
32
28
http://www.freescale.com
Reference Manual
Device Numbering Scheme
Package Information
Related Documentation
Revision History
Status
Memory
MC = Consumer &
S = Automotive Qualified
9 = Flash-based
Industrial
The 32 LQFP and 28 SOIC are not qualified to meet automotive requirements.
Small Outline Integrated Circuit
Family
Core
Low Quad Flat Pack
Low Quad Flat Pack
Package Type
(MC9S08MP16RM)
xx
Contains extensive product information including modes of operation, memory,
resets and interrupts, register definition, port pins, CPU, and all module
information.
9 S08
MC9S08MP16 Series Data Sheet, Rev. 1
Table 23. Package Descriptions
MP
nn
E2
Abbreviation
y
LQFP
LQFP
SOIC
NOTE
zz
Package designator (see
Temperature range
Wafer fab site and mask revision
Flash size
V = –40°C to 105°C
M = –40°C to 125°C
(this field appears only in automotive-qualified
16 KBytes
12 KBytes
Designator
part numbers)
WL
LC
LF
Case No.
873A-03
751F-05
932-03
Table
23)
Package Information
Document No.
98ASH00962A
98ASH70029A
98ASB42345B
35

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