pa2423g SiGe Semiconductor, pa2423g Datasheet - Page 4

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pa2423g

Manufacturer Part Number
pa2423g
Description
2.4 Ghz Bluetooth Class 1 Power Amplifier Ic Preliminary Information
Manufacturer
SiGe Semiconductor
Datasheet
Gold Bump Bare Die - Top and Side Views
The first drawing provides the top view of the gold bump bare die (gold bumps on top surface). This view
should be used for the chip-on-board mounting. The second drawing illustrates the side view of the die.
630Pmr20Pm
DOC # 05PDS003 S Rev 5 S
300 P m r 5 P m
(X=0,Y=0)
25 P m r 3 P m
142 P m
1
±10 P m
100
100
45
o
±0 P m
±0 P m
2
12
60±0 P m
60±0 P m
100±0 P m
SILICON
3
11
960 P m ± 20 P m
60±0 P m
60±0 P m
07/26/2001
460±0 P m
2.4 GHz Bluetooth Class 1 Power Amplifier IC
4
10
60±0 P m
60±0 P m
100
100
5
9
±0 P m
±0 P m
60±0 P m
60±0 P m
6
8
Preliminary Information
Gold
7
65Pmr10Pm
PA2423G
Page 4

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