pa2423g SiGe Semiconductor, pa2423g Datasheet - Page 5

• Manufacturer Part Number: pa2423g
• Description: 2.4 Ghz Bluetooth Class 1 Power Amplifier Ic Preliminary Information
• Manufacturer: SiGe Semiconductor

Gold Bump Bare Die – Bottom View
This drawing shows the gold bump bare die when viewed from the bottom of the die (without gold bumps).
This view and pintout orientation should be used for flip chip mounting – top surface of die (with gold bumps)
is inverted to make contact with PCB.
DOC # 05PDS003 S Rev 5 S
(X=0,Y=0)
(X=0,Y=0)
142Pm
142Pm
1
1
±10 P m
±10 P m
100
100
100
100
45
45
o
o
±0 P m
±0 P m
±0 P m
±0 P m
12
12
2
2
60±0 P m
60±0 P m
60±0 P m
60±0 P m
100±0 P m
100±0 P m
11
11
3
3
07/26/2001
960Pm ± 20Pm
960Pm ± 20Pm
60±0 P m
60±0 P m
60±0 P m
60±0 P m
2.4 GHz Bluetooth Class 1 Power Amplifier IC
460±0 P m
460±0 P m
10
10
4
4
60±0 P m
60±0 P m
60±0 P m
60±0 P m
100
100
100
100
9
9
5
5
±0 P m
±0 P m
±0 P m
±0 P m
60±0 P m
60±0 P m
60±0 P m
60±0 P m
Preliminary Information
8
8
6
6
7
7
65Pmr10Pm
65Pmr10Pm
PA2423G
Page 5