el5411t Intersil Corporation, el5411t Datasheet - Page 13

• Manufacturer Part Number: el5411t
• Description: 60mhz Rail-to-rail Input-output Operational Amplifier
• Manufacturer: Intersil Corporation

A snubber is a shunt load consisting of a resistor in series
with a capacitor. An optimized snubber can improve the
phase margin and the stability of the EL5411T. The
advantage of a snubber circuit is that it does not draw any
DC load current or reduce the gain.
Another method to reduce peaking is to add a series output
resistor (typically between 1Ω to 10Ω). Depending on the
capacitive loading, a small value resistor may be the most
appropriate choice to minimize any reduction in gain.
Power Dissipation
With the high-output drive capability of the EL5411T
amplifiers, it is possible to exceed the +150°C absolute
maximum junction temperature under certain load current
conditions. It is important to calculate the maximum power
dissipation of the EL5411T in the application. Proper load
conditions will ensure that the EL5411T junction temperature
stays within a safe operating region.
The maximum power dissipation allowed in a package is
determined according to Equation 1:
where:
• T
• T
• Θ
• P
The total power dissipation produced by an IC is the total
quiescent supply current times the total power supply
voltage, plus the power dissipation in the IC due to the loads,
or:
when sourcing, and:
when sinking,
where:
• i = 1 to 4
• V
• V
• V
• I
• V
• I
P
P
P
DMAX
DMAX
DMAX
(1, 2, 3, 4 corresponds to Channel A, B, C, D respectively)
(I
SMAX
LOAD
AMAX
JMAX
SMAX
DMAX
S
S
S
OUT
JA
+ = Positive supply voltage
- = Negative supply voltage
= Total supply voltage (
= Thermal resistance of the package
=
=
=
= Output voltage
= Load current
= Maximum supply current per amplifier
= Maximum junction temperature
= Maximum ambient temperature
= EL5411T quiescent current ÷ 4)
T
-------------------------------------------- -
= Maximum power dissipation allowed
Σi V
Σi V
JMAX
[
[
S
S
θ
×
×
–
JA
I
I
SMAX
SMAX
T
AMAX
+
+
(
(
V
V
S
OUT
13
V
+ V
S
–
+ - V
i V
–
OUT
S
S
-
)
- )
i )
×
×
I
I
LOAD
LOAD
i
i
]
]
(EQ. 1)
(EQ. 2)
(EQ. 3)
EL5411T
Device overheating can be avoided by calculating the
minimum resistive load condition, R
highest power dissipation. To find R
equations equal to each other and solve for V
Reference the package power dissipation curves, Figures 32
and 33, for further information.
Thermal Shutdown
The EL5411T has a built-in thermal protection which ensures
safe operation and prevents internal damage to the device
due to overheating. When the die temperature reaches
+165°C (typical) the device automatically shuts OFF the
outputs by putting them in a high impedance state. When the
die cools by +15°C (typical) the device automatically turns
ON the outputs by putting them in a low impedance (normal)
operating state.
FIGURE 32. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 33. PACKAGE POWER DISSIPATION vs AMBIENT
1.2
1.0
0.8
0.6
0.4
0.2
0.0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
0
962mW
893mW
3.29W
3.13W
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY (4-LAYER) TEST BOARD - EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
θ
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
JA
TEMPERATURE
TEMPERATURE
θ
TQFN16
JA
= +40°C/W
25
25
HTSSOP14
= +140°C/W
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
50
50
θ
θ
JA
JA
HTSSOP14
TQFN16
= +38°C/W
= +130°C/W
75
75
LOAD
LOAD
85
85
100
100
, resulting in the
set the two P
OUT
125
125
/I
October 8, 2009
LOAD
DMAX
FN6837.1
.
150
150