ts906c3r Fuji Electric holdings CO.,Ltd, ts906c3r Datasheet

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ts906c3r

Manufacturer Part Number
ts906c3r
Description
Silicon Diode
Manufacturer
Fuji Electric holdings CO.,Ltd
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ts906c3r-TE24R
Manufacturer:
FUJI/富士电机
Quantity:
20 000
CHECKED
CHECKED
DRAWN
Feb.-27-‘08
Feb.-27-‘08
Feb.-27-‘08
D A T E
N A M E
Device Name :
Type Name :
Spec. No.
S P E C I F I C AT I O N
APPROVED
SILICON DIODE
TS906C3R
MS5D3391
Fuji Electric Device Technology Co.,Ltd.
MS5D3391 1/12
H04-004-07b

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ts906c3r Summary of contents

Page 1

... Device Name : Type Name : Spec. No APPROVED Feb.-27-‘08 DRAWN Feb.-27-‘08 CHECKED Feb.-27-‘08 CHECKED SILICON DIODE TS906C3R : MS5D3391 Fuji Electric Device Technology Co.,Ltd. MS5D3391 1/12 H04-004-07b ...

Page 2

Revised Classi- Date Ind. fication Feb.-27 Enactment ― ―――――― -2007 Fuji Electric Device Technology Co.,Ltd. Records Applied Content Drawn date Issued date Checked Approved MS5D3391 2/12 H04-004-06b ...

Page 3

... This specification provides the ratings and the test requirement for FUJI SILICON DIODE TS906C3R 2.OUT VIEW, MOLDING RESIN, CHARACTERISTICS Ordering code Package type TS906C3R T-pack(S) Bar code label is EIAJ C-3 specification. Indispensable description items are shown as below. (1) Type name (2) Production code (3) Quantity (4) Lot № ...

Page 4

AND INSPECTION 4.1 STANDARD TEST CONDITION Standard test condition is Ta=25℃、65%R.H. If judgment is no doubt, the test condition is possible to test in normal condition Ta=5∼35℃、48∼85%R.H. 4.2 STRUCTURE INSPECTION It inspect with eye and measure, Item 2 shall ...

Page 5

Test Test Testing methods and conditions No. items High temp. Temperature :Tstg max 1 Storage Test duration : 1000h Low temp. Temperature :Tstg min 2 Storage Test duration : 1000h Temperature Temperature : 85±2°C 3 humidity Relative humidity : 85±5% ...

Page 6

Fuji Electric is continually improving product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the ...

Page 7

INSTALLATION ・Soldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Method Reflow ・Recommendation temperature profile(Reflow) 300 ...

Page 8

STORAGE ・The Diodes must be stored at a standard temperature 35℃ and relative humidity 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only deionized water ...

Page 9

Fuji Electric Device Technology Co.,Ltd. Sn-Ag plating (Pb<1000ppm) MS5D3391 9/12 H04-004-03a ...

Page 10

Forward Characteristic (typ.) 100 10 1 0.1 0.01 0.0 0.2 0.4 0.6 0.8 VF Forward Voltage (V) Forward Power Dissipation (max.) 14 360° λ 10 λ Square wave =60° λ Square wave =120° 8 λ Sine wave ...

Page 11

Current Derating (Io-Tc) (max.) 160 150 140 130 120 λ Sine wave =180° λ Square wave =180° 110 λ Square wave =120 100 λ Square wave =60° Average Output Current (A) λ ...

Page 12

Fuji Electric Device Technology Co.,Ltd. Transient Thermal Impedance (max.) Rth j-c: 1.0 ℃/ Time ( MS5D3391 12/12 H04-004-03a ...

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