stm1066 STMicroelectronics, stm1066 Datasheet
stm1066
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stm1066 Summary of contents
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... Available in flip chip 6-bump package ■ Operating temperature –30°C to +85°C Applications ■ Portable devices ■ Cell phones/smart phones ■ PDA ■ Palmtops ■ Organizers ■ Portable audio/video players ■ Portable terminals April 2008 Smart voltage supervisor Flip chip (6-bump) Rev 4 STM1066 1/20 www.st.com 1 ...
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Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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List of tables Table 1. Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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... Description The STM1066 device monitors V level (above V or below V TH+ The device offers several voltage thresholds, V miniature flip chip 6-bump package. Figure 1. Logic diagram , and connects OUT and the state of EN and INH inputs. TH- (see Table TH STM1066 ...
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Table 1. Pin descriptions Pin Figure 2. 6-bump flip chip connections OUT INH 2 bottom view, bumps up 6/20 Symbol V Supply for output pin (OUT ...
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... VBUS USB connector Band + gap - V CC USB charging and transceiver circuits V DC-DC step-up BAT converter OUT GND V BAT OUT Inhibit INH control GND STM1066 V IN OUT Level shifter LOGIC ai13916 V BOOST C 3 ASIC V CHARGER C 2 ai13917 7/20 ...
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... Operation The STM1066 connects or disconnects the output OUT, from the V logical combination of the enable input (EN), the inhibit input (INH), and the supply voltage level, V (see Table 2 CC 2.1 Output, OUT If the enable input logic high state and inhibit input logic low state, the output will be connected to V output is connected to ground GND ...
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Typical operating characteristics Figure 5. Supply current vs. supply voltage, V 3.0 2.5 2.0 1.5 1.0 0.5 0.0 2.5 Figure 6. Supply current vs. temperature, V 2.5 2.0 1.5 1.0 0.5 0.0 -30 -20 3.0 3.5 4.0 4.5 Supply ...
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Figure 7. Supply current vs. supply voltage, V 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 2.5 Figure 8. Supply current vs. temperature, V 0.65 0.60 0.55 0.50 0.45 -30 -20 10/20 EN 3.0 3.5 4.0 4.5 Supply Voltage, ...
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Figure 9. Rising voltage detector threshold vs. temperature 3.50 3.45 3.40 3.35 3.30 3.25 3.20 -30 -20 -10 Figure 10. Threshold hysteresis vs. temperature 550 500 450 400 350 300 250 -30 -20 -10 maximum value ...
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... These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 3. ...
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DC and AC characteristics This section summarizes the operating measurement conditions and the DC and AC characteristics of the device. The parameters in the DC and AC characteristics tables that follow are derived from tests performed under the measurement ...
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Table 5. DC and AC characteristics Sym Parameter V Supply voltage CC I Supply current into Current into Rising voltage detector threshold (see V TH+ Table 7 on ...
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Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner ...
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Table 6. Flip chip 6-bump, package mechanical data Symbol Min A 0.54 A1 0.170 A2 b 0.215 D 1. 0.36 E 0.77 E1 0.36 SE 0.18 f ccc $ 0.035 Figure 13. Flip chip tape and reel specifications ...
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... C25: 3.25 V (1) C30: 3.30 V C35: 3.35 V (1) C40: 3.40 V (1) C45: 3.45 V (1) C50: 3.50 V Package F3: Flip chip, lead-free, pitch = 400 µm, bump = 250 µm Temperature 8: –30°C to 85°C Shipping method ® ECOPACK package, tape & reel 1. Contact local ST sales office for availability. STM1066 C35 17/20 ...
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... Part number Min (–3%) STM1066C20F38F 3.104 STM1066C25F38F 3.152 STM1066C30F38F 3.201 STM1066C35F38F 3.249 STM1066C40F38F 3.298 STM1066C45F38F 3.346 STM1066C50F38F 3.395 1. Where “y” = assembly year ( and “ww” = assembly work week (01 to 52). 18/20 at ambient temperature TH+ T from –30 to +85°C A Typ Max (+3%) 3 ...
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Revision history Table 9. Document revision history Date Revision 06-Sep-2007 03-Jan-2008 26-Mar-2008 09-Apr-2008 1 Initial release. Updated cover page, Section 2 Figure 1: Logic diagram; minor text and presentation changes. 3 Updated Table Document status upgraded ...
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... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...