tsl2580 ETC-unknow, tsl2580 Datasheet - Page 32
tsl2580
Manufacturer Part Number
tsl2580
Description
Light-to-digital Converter
Manufacturer
ETC-unknow
Datasheet
1.TSL2580.pdf
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TSL2580, TSL2581
LIGHT-TO-DIGITAL CONVERTER
TAOS098 − MARCH 2010
32
Copyright E 2010, TAOS Inc.
The package has been tested and have demonstrated an ability to be reflow soldered to a PCB substrate. The
process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
T
peak
T
T
T
3
2
1
Time (sec)
Average temperature gradient in preheating
Soak time
Time above 217°C
Time above 230°C
Time above T
Peak temperature in reflow
Temperature gradient in cooling
Figure 23. TSL2580/TSL2581 Solder Reflow Profile Graph
peak
PARAMETER
Table 15. TSL2580/81 Solder Reflow Profile
−10°C
MANUFACTURING INFORMATION
t
soak
r
www.taosinc.com
REFERENCE
T
t
soak
peak
t
t
t
1
2
3
260° C (−0°C/+5°C)
r
2 to 3 minutes
Max −5°C/sec
TSL2580/81
Max 60 sec
Max 50 sec
Max 10 sec
2.5°C/sec
t
t
t
3
2
1
Not to scale — for reference only
The LUMENOLOGY r Company
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