PI409MC-A4 American Microsystems, Inc., PI409MC-A4 Datasheet - Page 2

• Manufacturer Part Number: PI409MC-A4
• Description: 400dpi CIS Module
• Manufacturer: American Microsystems, Inc.

sensing elements. Twenty seven of these imaging chips are cascaded to provide 3456
photo-elements module. The PI3022 chips are integrated with the photo sensors'
associated multiplex switches, a digital shift register and chip selection switch. The shift
register sequentially clocks out the integrated image charges from each sensing elements
and passes them through the chip-select switch and out onto the video line. The chip-
select switch are sequentially switched as each of the predecessor chip completes its
scan. These 27 sensors bonded on a PCB are grouped into 4 sub-cascaded sections.
Each contiguously cascaded chips section are connected on separate video lines,
accordingly providing four video outputs VOUT1, VOUT2, VOUT3 and VOUT4. Before
the signal charges from the four video lines appear at their respective outputs they are
converted to signal voltages by four on-board buffer amplifiers, one for each of its
corresponding video section. The first three sections VOUT1, VOUT2, and VOUT3 have 7
sensor chips, while the VOUT4 has 6 sensor chips. Since each sensor chip have 128
pixels, there are total of 3456 pixels. See Figure 1. PI409MC-A4 Module Block Diagram.
Mounted in the module housing, along with the PCB, is a one-to-one graded indexed
micro lens array that focuses the scanned documents' image onto the sensing line of the
sensor chips. The third major component mounted in the module is the LED light source.
See Figure 2. PI409MC-A4 Cross Sectional View. The pictorial cross section shows the
LED Bar light source and its Illumination path as it reflects the image from the document
and focuses through the ROD lens on to its image sensing line of the sensing chips. All
components are housed in a small plastic housing that has a cover glass. This cover
glass is, also, the window. It serves as the focal point for the object being scanned, as well
as to protect all of the critical components with the housing from dust. I/O to the module is
GLED
VLED
Figure 1. PI409MC-A4 Module Block Diagram
CP
1 2 3
BUFFER
(See Table 1 for pin-out designation)
LED
SP
SHIFT REGISTER
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LED
ROD LENSE
PHOTO SENSORS
LED
VIDEO 1 PIXEL 1 to 896
VIDEO 2 PIXEL 897 to 1792
VIDEO 3 PIXEL 1793 to 2688
VIDEO 4 PIXEL 2689 to 3456
GRD
LED
LED
3456
LED
LED
LED
AMPL 1
AMPL 2
AMPL 3
AMPL 4
VN(-V)
VDD(+5)
GRD
VOUT1
VOUT3
VOUT2
VOUT4