uc1602i-pp-m ETC-unknow, uc1602i-pp-m Datasheet - Page 4

• Manufacturer Part Number: uc1602i-pp-m
• Description: Single-chip, Ultra-low Power Passive Matrix Lcd Controller-driver
• Manufacturer: ETC-unknow

U
High-Voltage Mixed-Signal IC
O
General Notes
A
For improved readability, the specification contains many application data points. When application information is given, it
is advisory and does not form part of the specification for the device.
B
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of UltraChip’s delivery. There is no post waffle saw/pack testing performed on individual die.
Although the latest modern processes are utilized for wafer sawing and die pick-&-place into waffle pack carriers,
UltraChip has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, it is the
responsibility of the customer to test and quality their application in which the die is to be used. UltraChip assumes no
liability for device functionality or performance of the die or systems after handling, packing or assembly of the die.
L
These devices are not designed for use in life support appliances, or systems where malfunction of these products can
reasonably be expected to result in personal injuries. Customer using or selling these products for use in such
applications do so at their own risk.
2
IFE
PPLICATION
ARE
RDERING
LTRA
Nomenclature
UC1602I-PP-M
Part Number
S
D
UPPORT
UC1602I
IE
D
C
ISCLAIMER
I
NFORMATION
HIP
A
I
PPLICATIONS
NFORMATION
PP:
Memory
65 x 102
GU:
GD:
Fn:
Gold bumped, face up
Gold bumped, face down
Type n TCP film
Packaging
65 COM x 102 SEG
Drivers
Description
Mux Rate Supported
1/65, 1/49
Product Specifications
Versions
G
©2000