msm98p05 Oki Semiconductor, msm98p05 Datasheet - Page 13
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msm98p05
Manufacturer Part Number
msm98p05
Description
Voice Synthesis Ic With Built-in 2-mbit Otp Rom
Manufacturer
Oki Semiconductor
Datasheet
1.MSM98P05.pdf
(14 pages)
¡ Semiconductor
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SOP24-P-430-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
MSM98P05
(Unit : mm)
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