msm7542ts-k Oki Semiconductor, msm7542ts-k Datasheet
msm7542ts-k
Related parts for msm7542ts-k
msm7542ts-k Summary of contents
Page 1
... DIP (DIP20-P-300-2.54-S1) (Product name : MSM7541RS) 24-pin plastic SOP (SOP24-P-430-1.27-K) 26-pin plastic TSOP (TSOPII26/20-P-300-1.27-K) (Product name : MSM7541TS-K) This version: Aug. 1998 Previous version: Nov. 1996 (Product name : MSM7542RS) (Product name : MSM7541GS-K) (Product name : MSM7542GS-K) (Product name : MSM7542TS-K) MSM7541/7542 1/20 ...
Page 2
Semiconductor BLOCK DIAGRAM + AIN+ – RC AIN– Active GSX TMC – VFRO + SG SG PWI – AOUT– – AOUT BPF AD Transmit (8th) Conv. Controller Auto PLL Zero R–TIM LPF DA Receive (5th) ...
Page 3
Semiconductor PIN CONFIGURATION (TOP VIEW SGC AOUT AIN+ AOUT– AIN– PWI 4 17 GSX VFRO 5 16 TMC RSYNC PDN 8 13 BCLOCK ...
Page 4
Semiconductor PIN AND FUNCTIONAL DESCRIPTIONS AIN+, AIN–, GSX Transmit analog input and transmit level adjustment. AIN non-inverting input to the op-amp; AIN– inverting input to the op-amp; GSX is connected to the output of the ...
Page 5
Semiconductor PWI, AOUT+, AOUT– PWI is connected to the inverting input of the receive driver. The receive driver output is connected to the AOUT– pin. Therefore, the receive level can be adjusted with the pins VFRO, PWI, and AOUT–. ...
Page 6
Semiconductor RSYNC Receive synchronizing signal input. Eight required bits are selected from serial PCM signals on the PCMIN pin by the receive synchronizing signal. Signals in the receive section are synchronized by this synchronizing signal. This signal must be ...
Page 7
Semiconductor DG Ground for the digital signal circuits. This ground is separate from the analog signal ground. The DG pin must be connected to the AG pin on the printed circuit board to make a common analog ground. PDN ...
Page 8
Semiconductor SG Signal ground voltage output. The output voltage is 1/2 of the power supply voltage. The output drive current capability is 200 mA. This pin provides the SG level for CODEC peripherals. This output voltage level is undefined ...
Page 9
Semiconductor ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Analog Input Voltage Digital Input Voltage Storage Temperature RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage Operating Temperature Analog Input Voltage Digital Input High Voltage Digital Input Low Voltage Clock Frequency Sync ...
Page 10
Semiconductor ELECTRICAL CHARACTERISTICS DC and Digital Interface Characteristics Parameter Power Supply Current Input High Voltage Input Low Voltage High Level Input Leakage Current Low Level Input Leakage Current Digital Output Low Voltage Digital Output Leakage Current Input Capacitance (V ...
Page 11
Semiconductor Transmit Analog Interface Characteristics Parameter Input Resistance Output Load Resistance Output Load Capacitance Output Amplitude Offset Voltage Receive Analog Interface Characteristics Parameter Input Resistance Output Load Resistance Output Load Capacitance Output Amplitude Offset Voltage (V Symbol Condition R ...
Page 12
Semiconductor AC Characteristics Parameter Transmit Frequency Response Receive Frequency Response Transmit Signal to Distortion Ratio Receive Signal to Distortion Ratio Transmit Gain Tracking Receive Gain Tracking *1 Psophometric filter is used (V Freq. Level Symbol Condition (Hz) (dBm0) Loss ...
Page 13
Semiconductor AC Characteristics (Continued) Parameter Idle Channel Noise Absolute Level (Initial Difference) Absolute Level (Deviation of Temperature and Power) Absolute Delay Transmit Group Delay Receive Group Delay Crosstalk Attenuation *1 Psophometric filter is used *2 Input "0" code to ...
Page 14
Semiconductor AC Characteristics (Continued) Parameter Discrimination Out-of-band Spurious Intermodulation Distortion D-to-D Mode Gain Power Supply Noise Rejection Ratio Digital Output Delay Time *1 The measurement under idle channel noise (V Freq. Level Symbol Condition (Hz) (dBm0) 4.6 kHz to ...
Page 15
Semiconductor TIMING DIAGRAM PCM Data Input/Output Timing Transmit Timing BCLOCK XSYNC XD1 SD PCMOUT MSD £ 1/2 • Fc, the Delay of the MSD bit is defined ...
Page 16
Semiconductor APPLICATION CIRCUIT Analog interface 0.1 mF Analog input Analog output +3 FREQUENCY CHARACTERISTICS ADJUSTMENT CIRCUIT Microphone amp M C1 Receiver impedance to 1 MSM7541/7542 AIN– ...
Page 17
Semiconductor RECOMMENDATIONS FOR ACTUAL DESIGN • To assure proper electrical characteristics, use bypass capacitors with excellent high frequency characteristics for the power supply and keep them as close as possible to the device pins. • Connect the AG pin ...
Page 18
Semiconductor PACKAGE DIMENSIONS DIP20-P-300-2.54-S1 MSM7541/7542 (Unit : mm) Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating more Solder plate thickness Package weight (g) 1.49 TYP. 18/20 ...
Page 19
Semiconductor SOP24-P-430-1.27-K Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed ...
Page 20
Semiconductor TSOPII26/20-P-300-1.27-K Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed ...