le79555 Zarlink Semiconductor, le79555 Datasheet - Page 20

• Manufacturer Part Number: le79555
• Description: Subscriber Line Interface Circuit
• Manufacturer: Zarlink Semiconductor

PHYSICAL DIMENSIONS
44-Pin TQFP
Notes:
Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the
device. Markings will vary with the mold tool used in manufacturing.
BSC is an ANSI standard for basic centering. Dimensions are measured in millimeters.
Symbol
ddd
aaa
ccc
D1
A1
A2
E1
b1
A
D
E
N
L
e
b
JEDEC #: MS-026 (C) ACB
Min
0.05
0.95
0.45
0.30
0.30
-
0.80 BSC
12 BSC
10 BSC
12 BSC
10 BSC
Nom
1.00
0.60
0.37
0.35
0.10
0.20
0.20
44
-
-
Max
1.20
0.15
1.05
0.75
0.45
0.40
Zarlink Semiconductor Inc.
Notes:
1. All dimensions and toleerances conform to ANSI Y14.5-1982.
2. Datum plane -H- is located at the mold parting line and is coincident
3. Dimensions “D1” and “E1” do not include mold protrusion. Allowable
4. Dimension “B” does not include Dambar protrusion. Allowable Dambar
5. Controlling dimensions: Millimeter.
6. Dimensions “D” and “E” are measured from both innermost and
7. Deviation from lead-tip true position shall be within ±0.076mm for pitch
8. Lead coplanarity shall be within: (Refer to 06-500)
9. Half span (center of package to lead tip) shall be
10. “N” is the total number of terminals.
11. The top of package is smaller than the bottom of the package by 0.15mm.
12. This outline conforms to Jedec publication 95 registration MS-026
13. The 160 lead is a compliant depopulation of the 176 lead MS-026
with the bottom of the lead where the lead exits the plastic body.
protrusion is 0.254mm per side. Dimensions “D1” and “E1” include
mold mismatch and are determined at Datum plane -H- .
protrusion shall be 0.08mm total in excess of the “b” dimension at
maximum material condition. Dambar can not be located on the lower
radius or the foot.
outermost points.
1- 0.10mm for devices with lead pitch of 0.65-0.80mm.
2- 0.076mm for devices with lead pitch of 0.50mm.
Coplanarity is measured per specification 06-500.
15.30 ± 0.165mm {.602”±.0065”}.
44-Pin TQFP
variation BGA.
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