se2545a30 SiGe Semiconductor, se2545a30 Datasheet - Page 13

• Manufacturer Part Number: se2545a30
• Description: Dual Band 802.11n Wireless Lan Front End
• Manufacturer: SiGe Semiconductor

Package Information
Figure 5 and Figure 6 show the detailed device package diagram. The pads on the SiGe RF modules are plated with
gold over nickel, with a gold thickness of approx. 0.75 to 1.0 um. The modules can be reflowed onto FR4 based
material using eutectic Pb based or common tin based Pb free solder pastes.
211-DST-01 Rev 1.0 Apr-26-2006
GND
GND
GND
GND
DETAIL "A"
DETAIL "B"
DETAIL "B"
DETAIL "A"
Figure 6: SE2545A30 Detailed Package Diagram (173-POD-01-01)
OPENING
OPENING
OPENING
OPENING
GROUND
GROUND
GROUND
GROUND
GND
GND
BOTTOM SIDE
Figure 5: SE2545A30 Package Diagram (173-POD-01-01)
GND
GND
DETAIL "A"
DETAIL "A"
GND
GND
DETAIL "A"
DETAIL "A"
OPENING
GROUND
OPENING
GROUND
OPENING
GROUND
OPENING
GROUND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
DETAIL "A"
DETAIL "C"
DETAIL "C"
DETAIL "A"
GROUND
OPENING
GROUND
OPENING
GROUND
OPENING
GROUND
OPENING
GND
GND
GND
GND
GND
GND
GND
GND
TOP SIDE
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Dual Band 802.11n Wireless LAN Front End
NOTES :
GROUND OPENING
DETAIL "A"
C L
C L
GROUND OPENING
PAD OPENING
PAD OPENING
DETAIL "D"
DETAIL "F"
DETAIL "B"
C L
C L
Preliminary Information
C L
C L
C L
GROUND OPENING
PAD OPENING
PAD OPENING
SE2545A30
DETAIL "E"
DETAIL "G"
DETAIL "C"
C L
C L
C L
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C L