se2545a30 SiGe Semiconductor, se2545a30 Datasheet - Page 14

• Manufacturer Part Number: se2545a30
• Description: Dual Band 802.11n Wireless Lan Front End
• Manufacturer: SiGe Semiconductor

Recommended PCB Footprint
211-DST-01 Rev 1.0 Apr-26-2006
(14.00)
(14.00)
12.30
SEE "SM1" DETAIL
SEE "SP1" DETAIL
SEE "SP2" DETAIL
SEE "P1" DETAIL
VIA IN "P1" PAD
TYP 48 PLCS
TYP 48 PLCS
TYP 24 PLCS
PCB METAL
Figure 8: Recommended PCB Footprint – Solder Mask and Stencil Patterns (173-DWG-10-1.0)
PIN #1
PIN #1
3x 5.00
3x 2.10
3x 2.10
3x 5.00
3x 5.00
3x 2.10
3x 2.10
3x 5.00
Figure 7: Recommended PCB Footprint – PCB Metal, Via Hole Pattern (173-DWG-10-1.0)
0.0
0.0
10
11
12
13
14
10
11
12
13
14
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
48
15
15
SOLDER MASK AND STENCIL PATTERNS
48
47
16
PCB METAL, VIA HOLE PATTERN
47
16
17
46
17
46
(X-Ray View Thru Package)
(X-Ray View Thru Package)
18
45
18
45
44
19
19
44
8.30
(10.00)
43
20
43
20
42
21
42
21
22
41
22
41
23
40
23
40
39
24
39
24
38
37
36
35
34
33
32
31
30
29
28
27
26
25
38
37
36
35
34
33
32
31
30
29
28
27
26
25
10x 6.65
2x 5.53
2x 4.68
2x 3.83
2x 2.98
2x 2.13
2x 1.28
2x 0.48
0.0
2x 0.48
2x 1.28
2x 2.13
2x 2.98
2x 3.83
2x 4.68
2x 5.53
10x 6.65
10x 6.65
10x 6.65
2x 5.53
2x 4.68
2x 3.83
2x 2.98
2x 2.13
2x 1.28
2x 0.48
0.0
2x 0.48
2x 1.28
2x 2.13
2x 2.98
2x 3.83
2x 4.68
2x 5.53
MODULE OUTLINE
MODULE OUTLINE
SEE "VP3" DETAIL
SEE "VP2" DETAIL
TYP 2 PLCS
SEE "VP1" DETAIL
TYP 12 PLCS
SEE "SM4" DETAIL
SEE "SM3" DETAIL
TYP 2 PLCS
SEE "SM2" DETAIL
TYP 12 PLCS
0.70 TYP
Dual Band 802.11n Wireless LAN Front End
0.70 TYP
VIA HOLE DRILL PATTERN
DETAIL "VP1"
PCB METAL PAD
0.60
DETAIL "P1"
(2.00)
C L
0.60
C L
0.10 TYP
0.72 TYP
0.10 TYP
(2.200)
1.450
0.250 TYP
C L
C L
0.050 TYP
STENCIL APERTURE PATTERN
STENCIL APERTURE PATTERN
STENCIL APERTURE PATTERN
0.700
0.700
SOLDER MASK OPENING &
SOLDER MASK OPENING &
RECOMMENDED SOLDER
RECOMMENDED SOLDER
RECOMMENDED SOLDER
(2.20)
DETAIL "SM1"
0.600
DETAIL "SM3"
DETAIL "SP1"
NOTES:
PAGE 1= PCB METAL & VIA HOLE INFORMATION
PAGE 2= SOLDERMASK & STENCIL OPENING INFORMATION
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCES CONFORM TO ASME Y14.5M-1994.
3. UNLESS SPECIFIED DIMENSIONS ARE SYMMETRICAL ABOUT CENTER LINES.
4. VIA HOLE INFORMATION:
5. SOLDER MASK GEOMETRY FEATURES:
6. SOLDER STENCIL APERTURE FEATURES:
7. RECOMMENDED SOLDER STENCIL THICKNESS: 0.13mm.
(2.000)
SEE PAGE 1 0F 2 FOR ALL NOTES
2.200
C L
C L
C L
0.35 TYP
3a. RECOMMENDED VIA HOLE SIZE (Ø): 0.200 - 0.300mm
3b. RECOMMENDED VIA HOLE PITCH: 0.70mm
3c. RECOMMENDED VIA WALL Cu PLATING: 30-35um
3d. RECOMMENDED THAT VIAS BE TENTED WITH SOLDERMASK
3e. VIA IN "P1" PAD DETAIL, TYP 24 PLCS.
3f. TOTAL VIA COUNT AS SHOWN: 152.
4a. ALL PERIPHERAL PCB PADS ARE NON-SOLDER MASK DEFINED.
4b. ALL GROUND PADDLE FEATURES ARE SOLDER MASK DEFINED.
5a. SOLDER STENCIL APERTURE OPENINGS ARE 1:1 WITH PCB
5b. RECOMMENDED SOLDER STENCIL APERTURE ARRAY TO
0.70 TYP
C L
ON PCB BACKSIDE AND FILLED WITH SOLDER.
PERIPHERAL METAL PADS.
TARGET APPROXIMATELY 50 - 80% COVERAGE OF SOLDER
MASK OPENINGS, EXCEPT AS NOTED.
VIA HOLE DRILL PATTERN
0.600
SOLDER MASK
STENCIL APERTURE
& PCB METAL PAD
ARE THE SAME SIZE
DETAIL "VP2"
RECOMMENDED STENCIL
SEE NOTE 5b FOR
APERTURE GUIDELINES
C L
SEE NOTE 5b FOR
RECOMMENDED STENCIL
APERTURE GUIDELINES
0.15
C L
0.15 TYP
(2.20)
Preliminary Information
C L
C L
0.10 TYP
(1.45)
0.225 TYP
0.72 TYP
0.10 TYP
1.450
0.10 TYP
(2.200)
2.200
0.35 TYP
STENCIL APERTURE PATTERN
STENCIL APERTURE PATTERN
STENCIL APERTURE PATTERN
0.70 TYP
SOLDER MASK OPENING &
SOLDER MASK OPENING &
RECOMMENDED SOLDER
RECOMMENDED SOLDER
RECOMMENDED SOLDER
SE2545A30
DETAIL "SM2"
DETAIL "SM4"
DETAIL "SP2"
VIA HOLE DRILL PATTERN
(2.000)
DETAIL "VP3"
2.000
3.050
C L
C L
C L
(3.05)
C L
0.35 TYP
C L
C L
14 of 18
NOTICE MISSING APERTU
OPENING, SEE DETAIL AT
LEFT, 3 PLCS ONLY
SEE NOTE 5b FOR
RECOMMENDED STENC
APERTURE GUIDELINE
SEE NOTE 5b FOR
RECOMMENDED STEN
APERTURE GUIDELINE
SEE NOTE 5b FOR
RECOMMENDED STE
APERTURE GUIDELIN
0.15 TYP
0.15 TYP
0.15
C L
C L
(1.45)