maamgm0007-die Tyco Electronics, maamgm0007-die Datasheet - Page 5

• Manufacturer Part Number: maamgm0007-die
• Description: 2.0-18.0 Ghz Distributed Amp/gain Block
• Manufacturer: Tyco Electronics

Specifications subject to change without notice.
Email: [e-mail]
2.0-18.0 GHz Distributed Amp/Gain Block
North America: Tel. [phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Bond Pad Dimensions
1.503mm
0.367mm
0
5 Volt Supply: VD_5
6 Volt Supply: VD_6
7 Volt Supply: VD_7
8 Volt Supply: VD_8
Mechanical Information
Chip Size: 1.67 x 3.00 x 0.075 mm
RF In and Out
0
GND:G
GND:G
IN
Pad
Chip edge to bond pad dimensions are shown to the center of the bond pad.
G N D : G
G N D : G
VD_5
GND:G
GND:G
VD_6 VD_7
Figure 8. Die Layout
GND:G
GND:G
VD_8
Size (µm)
150 x 150
150 x 150
100 x 100
100 x 100
100 x 100
GND:G
GND:G
(
65 x 118 x 3 mils)
GND:G
GND:G
MAAMGM0007-DIE
GND:G
GND:G
GND:G
OUT
G N D : G
Size (mils)
6 x 6
6 x 6
4 x 4
4 x 4
4 x 4
1.558mm
0.907mm
1.665mm
5