maamgm0007-die Tyco Electronics, maamgm0007-die Datasheet - Page 6

• Manufacturer Part Number: maamgm0007-die
• Description: 2.0-18.0 Ghz Distributed Amp/gain Block
• Manufacturer: Tyco Electronics

Specifications subject to change without notice.
Email: [e-mail]
2.0-18.0 GHz Distributed Amp/Gain Block
North America: Tel. [phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
V
DD
Drain Voltage to Pad Connection
RF
Figure 9. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
Refer to table below for bonding to achieve desired operation.
IN
0.1 µF
6 Volt Supply: VD_6
7 Volt Supply: VD_7
8 Volt Supply: VD_8
5 Volt Supply: VD_5
GND:G
GND:G
IN
G N D : G
G N D : G
VD_5
GND:G
GND:G
100 pF
VD_6
GND:G
GND:G
Applied Voltage
VD_7
(Volts)
VD_8
4
5
6
6
7
8
GND:G
GND:G
GND:G
GND:G
Operational Voltage
MAAMGM0007-DIE
(Volts)
GND:G
GND:G
GND:G
OUT
G N D : G
4
5
6
5
5
5
RF
OUT