bga735l16 Infineon Technologies Corporation, bga735l16 Datasheet - Page 37

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bga735l16

Manufacturer Part Number
bga735l16
Description
High Linearity Tri-band Umts Lna
Manufacturer
Infineon Technologies Corporation
Datasheet

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4
4.1
Figure 8
Data Sheet
Physical Characteristics
Package Footprint
Recommended footprint and stencil layout for the TSLP-16-1 package
0.3
0.3
0.225
Copper
Copper
0.35
0.3
0.3
S M D - V 1
0.2
0.2
0.225
0.3
0.3
0.55
0.2
0.2
Solder mask
Solder mask
0.3
0.3
0.2
0.2
0.2
0.2
0.3
0.3
Vias top to first inner layer
N S M D
BGA735L16 - Low Power Tri-Band UMTS LNA
37
S M D - V 2 ( e . g . B G A 7 3 4 L 1 6 )
0.3
0.3
0.225
0.225
Stencil apertures
0.35
0.3
0.3
0.2
0.2
0.3
0.3
0.075
0.275
0.55
0.2
0.2
0.3
0.3
0.2
0.2
0.2
0.2
TSLP-16-1-FP V01
0.3
0.3
Physical Characteristics
Package Footprint
V3.0, 2008-08-26

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