hip0050 Intersil Corporation, hip0050 Datasheet
hip0050
Available stocks
Related parts for hip0050
hip0050 Summary of contents
Page 1
... Shutdown is maintained until the on-chip temper- ature falls below the minimum hysteresis threshold point. The HIP0050 is fabricated in a Power BiMOS IC process, and is intended for use in automotive and other applications having a wide range of temperature and electrical stress conditions ...
Page 2
... SERIAL DATA (LATCHED HIP0050 Q0 OUTPUT LATCH Q1 Q2 POR OVER-TEMPERATURE SHUTDOWN W/HYS DR1 OFF ...
Page 3
... Edge Threshold Voltage at Rising Edge Hysteresis Voltage V H Leakage Current I LIN SERIAL DATA CLOCK (SCK) (Refer to Figure 1 for Waveform Detail) Frequency f SCK Pulse Width High t W(SCKH) HIP0050 Thermal Information OC +0.3V CC Package CL PDIP . . . . . . . . . . . . . - SOIC . . . . . . . . . . . . . 150 C † ...
Page 4
... The HIP0050 Output Drive is protected by an internal current shutdown. The I defines the maximum current. The minimum limit for this threshold is 300mA. The maximum current with all outputs ON may be further limited by dissipation. 3. Package dissipation is based on thermal resistance capability in a normal operating environment. The junction to ambient thermal resis- tance values are defined here Board mounted device with minimal copper ...
Page 5
... The serial data out allows other ICs to be serially cascaded. For example, a 10-bit LED driver may be located behind the HIP0050. A controlling microprocessor may then clock out 18-bits of information and simultaneously strobe both parts. The cascaded ICs may be the same or different from the HIP0050 ...
Page 6
... Dambar protrusions shall not exceed 0.010 inch (0.25mm the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). HIP0050 E20.3 (JEDEC MS-001-AD ISSUE D) 20 LEAD DUAL-IN-LINE PLASTIC PACKAGE SYMBOL ...
Page 7
... However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com HIP0050 M24.3 (JEDEC MS-013-AD ISSUE C) ...